Thermal Analysis of Wind and Solar Systems

  • Alhussein AlbarbarEmail author
  • Canras Batunlu


This chapter presents case studies on lifetime and reliability analysis for power electronic devices based on the electrothermal and thermomechanical characteristics. Model outcomes are validated, in real time, using dSPACE system with a physical permanent magnet generator based wind turbine system test rig. Effects of maximum power point tracking algorithms on lifetime and thermal stresses in DC–DC converters under different operating conditions are also studied. Converter’s electrothermal characteristics were first modeled. Subsequently, experiments on photovoltaic solar system were carried out using two different MPPT algorithms, namely, perturb and observe (P&O) and incremental conductance (IC).


Reliability analysis Wind turbines Photovoltaic solar systems dSPACE system Permanent magnet generator Maximum power point tracking algorithms DC–DC converters 


  1. 1.
    I.V. Banu, R. Beniuga, and M. Istrate, Comparative analysis of the perturb-and-observe and incremental conductance MPPT methods, in 2013 8th International Symposium on Advanced Topics in Electrical Engineering (ATEE), (2013) pp. 1–4Google Scholar
  2. 2.
    A. Mahdi, W. Tang, H. Wu, and A. Mahdi, Improvement of a MPPT algorithm for PV systems and its experimental validation. Presented at the the 10th international conference on renewable energies and power quality, Granada, Spain, (2010), pp. 1–6Google Scholar
  3. 3.
    A. Mondal, S. Yuvarajan, MPPT scheme for small scale photovoltaic systems using dSPACE, in 2012 IEEE Green Technologies Conference, (2012), pp. 1–3Google Scholar
  4. 4.
    F. Casanellas, Losses in PWM inverters using IGBTs. Electr. Power Appl. IEE Proc. 141(5), 235–239 (1994). (Eylül)CrossRefGoogle Scholar
  5. 5.
    N. Mohan, Advanced Electric Drives: Analysis, Control, and Modeling Using MATLAB/Simulink (Wiley, Hoboken, 2014)CrossRefGoogle Scholar
  6. 6.
    M.P. Kaźmierkowski, R. Krishnan, F. Blaabjerg, Control in Power Electronics: Selected Problems (Academic Press, Cambridge, 2002)Google Scholar
  7. 7.
    Y. Liu, Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling (Springer, New York, 2012)CrossRefGoogle Scholar
  8. 8.
    H. Wang, K. Ma, F. Blaabjerg, Design for reliability of power electronic systems, in IECON 2012—38th Annual Conference on IEEE Industrial Electronics Society, (2012), pp. 33–44Google Scholar
  9. 9.
    M. Denk, M.-M. Bakran, M. Denk, M.-M. Bakran, Online junction temperature cycle recording of an IGBT power module in a hybrid car. Adv. Power Electron. 2015, e652389 (2015)CrossRefGoogle Scholar
  10. 10.
    K. Mainka, M. Thoben, O. Schilling, Lifetime calculation for power modules, application and theory of models and counting methods, in Proceedings of the 2011–14th European Conference on Power Electronics and Applications (EPE 2011), (2011), pp. 1–8Google Scholar
  11. 11.
    A. Niesłony, Determination of fragments of multiaxial service loading strongly influencing the fatigue of machine components. Mech. Syst. Sig. Process. 23(8), 2712–2721 (2009). (Kasım)CrossRefGoogle Scholar
  12. 12.
    J. Lemaitre, J.-L. Chaboche, Mechanics of Solid Materials (Cambridge University Press, Cambridge, 1994)zbMATHGoogle Scholar
  13. 13.
    I. Houssamo, F. Locment, M. Sechilariu, Maximum power tracking for photovoltaic power system: development and experimental comparison of two algorithms. Renew. Energy 35(10), 2381–2387 (2010). (Ekim)CrossRefGoogle Scholar
  14. 14.
    Y. Liu, M. Li, X. Ji, X. Luo, M. Wang, Y. Zhang, A comparative study of the maximum power point tracking methods for PV systems. Energy Convers. Manag. 85, 809–816 (2014). (Eylül)CrossRefGoogle Scholar
  15. 15.
    K. Ma, A.S. Bahman, S. Beczkowski, F. Blaabjerg, Complete loss and thermal model of power semiconductors including device rating information. IEEE Trans. Power Electron. 30(5), 2556–2569 (2015)CrossRefGoogle Scholar
  16. 16.
    Q. Chen, X. Yang, Z. Wang, L. Zhang, M. Zheng, Thermal design considerations for integrated power electronics modules based on temperature distribution cases study, in IEEE Power Electronics Specialists Conference, 2007. PESC 2007, (2007), pp. 1029–1035Google Scholar
  17. 17.
    A. Marinov, V. Valchev, Power loss reduction in electronic inverters trough IGBT-MOSFET combination. Procedia Earth Planet. Sci. 1(1), 1539–1543 (2009). (Eylül)CrossRefGoogle Scholar
  18. 18.
  19. 19.
    A.P.C. Rao, Y.P. Obulesh, C.S. Babu, Analysis and effect of switching frequency and voltage levels on total harmonic distortion in multilevel inverters, in 2012 International Conference on Emerging Trends in Electrical Engineering and Energy Management (ICETEEEM), (2012), pp. 339–344Google Scholar
  20. 20.
    H. Akagi, Active harmonic filters. Proc. IEEE 93(12), 2128–2141 (2005). (Aralık)CrossRefGoogle Scholar

Copyright information

© Springer International Publishing AG 2018

Authors and Affiliations

  1. 1.School of EngineeringThe Manchester Metropolitan UniversityManchesterUnited Kingdom

Personalised recommendations