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Fundamental Thermal Characterization of PECs

  • Alhussein AlbarbarEmail author
  • Canras Batunlu
Chapter
  • 870 Downloads

Abstract

The implementation of an electrothermal, 3D finite element model for a multichip single IGBT power module is presented in this chapter. The model was built with COMSOL finite element package. Based on the thermal profile extracted from finite element (FE) analysis, a compact electrothermal model was implemented in discrete z-domain with MATLAB/Simulink for continuous temperature estimations over each layer based on the heat interactions and coupling effect across IGBT/diode chips.

Keywords

Insulated gate bipolar transistor COMSOL Finite element model MATLAB and Simulink 

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Copyright information

© Springer International Publishing AG 2018

Authors and Affiliations

  1. 1.School of EngineeringThe Manchester Metropolitan UniversityManchesterUnited Kingdom

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