Abstract
The implementation of an electrothermal, 3D finite element model for a multichip single IGBT power module is presented in this chapter. The model was built with COMSOL finite element package. Based on the thermal profile extracted from finite element (FE) analysis, a compact electrothermal model was implemented in discrete z-domain with MATLAB/Simulink for continuous temperature estimations over each layer based on the heat interactions and coupling effect across IGBT/diode chips.
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Albarbar, A., Batunlu, C. (2018). Fundamental Thermal Characterization of PECs. In: Thermal Analysis of Power Electronic Devices Used in Renewable Energy Systems. Springer, Cham. https://doi.org/10.1007/978-3-319-59828-4_3
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DOI: https://doi.org/10.1007/978-3-319-59828-4_3
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