Abstract
This chapter reviews the main physical mechanisms responsible for the degradation of InGaN-based optoelectronic devices at chip level. The generation of defects caused by bias and temperature is frequent in modern devices, being responsible for the increase in non-radiative recombination and forward leakage current. Deep level enhancement related to diffusion will also be discussed. The investigation will then move to further processes, such as degradation of the ohmic contacts, electromigration, and device cracking due to mismatch. In addition, we described failure processes related to extrinsic factors, namely, electrostatic discharges and electrical overstresses, along with possible structure improvements that permit to increase device robustness. Finally, degradation caused by reverse bias will be investigated, a topic of growing interest for the design of AC-powered LEDs.
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De Santi, C., Meneghini, M., Meneghesso, G., Zanoni, E. (2018). Chip-Level Degradation of InGaN-Based Optoelectronic Devices. In: van Driel, W., Fan, X., Zhang, G. (eds) Solid State Lighting Reliability Part 2. Solid State Lighting Technology and Application Series, vol 3. Springer, Cham. https://doi.org/10.1007/978-3-319-58175-0_2
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