Abstract
Thermal management must ensure that temperatures within the electronic product always remain within the specified limits. This chapter introduces and elaborates on determining the heat energy produced by a system (Sect. 5.1) and on calculating the heat paths with thermal networks (Sect. 5.2). The heat transfer principles described in Sect. 5.3 will help the reader select and design suitable elements for heat dissipation (Sect. 5.4). They assure compliance with the thermal requirements for various electronic system configurations that are presented in a step-by-step approach in Sect. 5.5. Finally, recommendations for thermally correct systems design will be given in Sect. 5.6.
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- 1.
The temperature source in a thermal network is less a “source” and instead is more an element with a predefined temperature that cannot be impacted by the network. Temperature sources are integrated in the thermal network where constant or predefined temperatures are specified, for example, constant external (room) temperatures.
- 2.
The primary exception to this statement is diamond which has a fivefold higher thermal conductivity than copper, but a dielectric strength 10 times higher than rubber.
- 3.
While bare surfaces radiate approximately 25% of the dissipated heat (i.e., 75% by convection), painted surfaces radiate roughly 55–60% (i.e., 40–45% by convection).
References
R. Reemsburg, Thermal Design of Electronic Equipment (Electronics Handbook), CRC Press, 2000
VDI Heat Atlas, 2nd edition, Springer, 2010
G. N. Dulnjev, N. N. Tarnovski, Teplovye rezimy elektronnoj apparatury, Energija, 1971
www.fischerelektronik.de (January 2014)
B. Shelkpuk, “Heat Exchangers Cool Hot Plug-in PC Boards”, Electronics, June 27, pp. 114-120, 1974
C. Markert, Erwärmungsprobleme in elektronischen Geräten und ihre konstruktive Berücksichtigung, Ph.D. Thesis, TU Dresden, Dresden, Germany, 1965
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Lienig, J., Bruemmer, H. (2017). Thermal Management and Cooling. In: Fundamentals of Electronic Systems Design. Springer, Cham. https://doi.org/10.1007/978-3-319-55840-0_5
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DOI: https://doi.org/10.1007/978-3-319-55840-0_5
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