Abstract
Interposer testing must be done at the pre-bond stage and at the post-bond stage. While pre-bond testing is obviously important and is receiving attention [1], including in Chap. 2 of this book, the focus of this chapter is on post-bond testing, which allows us to target defects in the interposer interconnects and the micro-bumps in an integrated manner. Post-bond testing allows us to detect defects in the interposer (e.g., shorts and opens), as well as faults due to missing or deformed micro-bumps faults that cause misalignment between dies, micro-bumps, and the interposer. However, post-bond testing is difficult due to limited access to the TSVs and the RDL inside the interposer.
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Wang, R., Chakrabarty, K. (2017). Post-bond Scan-Based Testing of Interposer Interconnects. In: Testing of Interposer-Based 2.5D Integrated Circuits. Springer, Cham. https://doi.org/10.1007/978-3-319-54714-5_3
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DOI: https://doi.org/10.1007/978-3-319-54714-5_3
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