Abstract
The paper presents a developed system for monitoring emotional states, depending on different stress factors, based on electrodermal response. The system is based on e-Health Sensor Shield platform developed by the Libelium company. Parameters monitored in order to set off emotional states are: galvanic skin response and body temperature. The information is sent wirelessly to a computer and the precessed using a virtual instrument developed in LabView. The proposed system allows monitoring a maximum of 253 subjects simultaneously.
At the end of the paper are presented the main conclusions related to the emotional states system development and implementation.
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References
Milici L D, Plăcintă V M, Bujor, L, Milici M R System for highlighting the emotional states, used in assessing the teaching methods, În: 9th International Symposium on Advanced Topics in Electrical Engineering, Bucharest, Romania, 7-9 May, 2015.
Boucsein W Electrodermal Activity, New York: Editura Oxford Springer, 2012.
Bronzino J D The Biomedical Engineering HandBook, Second Edition, Florida: CRC Press, 2000.
***https://www.cooking-hacks.com/ehealth-sensors-complete-kit-biometric-medical-arduino-raspberry-pi, accessed in 08.08.2016.
***https://www.robofun.ro/senzor-temperatura-umiditate-sht11, accessed in 12.08.2016.
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Cenușă, M., Poienar, M., Milici, L.D., Pața, S.D. (2017). Monitoring System for the Emotional States. In: Vlad, S., Roman, N. (eds) International Conference on Advancements of Medicine and Health Care through Technology; 12th - 15th October 2016, Cluj-Napoca, Romania. IFMBE Proceedings, vol 59. Springer, Cham. https://doi.org/10.1007/978-3-319-52875-5_19
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DOI: https://doi.org/10.1007/978-3-319-52875-5_19
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