Abstract
The superior heat dissipation characteristic of diamond reinforced metal matrix composites has started to demonstrate significant performance advantages in RF Amplifier designs especially when heat dissipation from GaN on SiC and GaN on Diamond devices is a concern. This paper outlines some of the benefits of replacing traditional heatsinks/heat spreaders such as CuW, CuMo and CMC with Diamond Copper and Diamond Aluminum in these RF Amplifier designs. Fabrication process of aluminum based diamond and SiC reinforced metal matrix composites is also reported.
This is a preview of subscription content, log in via an institution.
Buying options
Tax calculation will be finalised at checkout
Purchases are for personal use only
Learn about institutional subscriptionsReferences
Ray Pengelly, and RF Cree. 2009. GaN HEMT technical status: Transistors and MMICs for military and commercial systems. Research Triangle Park, NC 27709. IMS 2009 Boston, MA Presentation. Slide 10, 38 and 40.
Bollina, Ravi, and Sven Knippscheer. 2008. Advanced metal diamond composites—Love and heat relationship. Electronics Cooling 14(4): 20.
Loutfy, K., and H. Hirotsuru. 2011. Advanced diamond based metal matrix composites for thermal management of RF devices. Wireless and Microwave Technology Conference (WAMICON), 2011 IEEE 12th Annual; 2011 Apr 18–19, Clearwater Beach.
Pickard, S.M., et al. 2007. High thermal conductivity metal matrix composites. Patent 7,279,023 B2.
Johnson, W.B., and B. Sonuparlak. 1993. Diamond/Al metal matrix composites formed by the pressureless metal infiltration process. Journal of Materials Research 8: 1169–1173. doi:10.1557/JMR.1993.1169.
North Dakota State University, Electron Microscope Laboratory, https://www.ndsu.edu/ndsucorelabs/electron-microscopy-center-people/. Accessed 5 Aug 2016.
Abyzov, Andrey M., Miroslaw J. Kruszewski, Lukasz Ciupinski, Marta Mazurkiewicz, Andrzej Michalski, and Krzysztof J. Kurzydlowski. 2015. Diamond-tungsten based coating-copper composites with high thermal conductivity produced by Pulse Plasma Sintering. Materials and Design 76: 97–109. Journal homepage: www.elsevier.com/locate/matdes
Rape, A., X. Liu, A. Kulkarni, and J. Singh. 2012. Alloy Development for Highly Conductive Thermal Management Materials Using Copper-Diamond Composites Fabricated by Field Assisted Sintering Technology. Springer. Received: 18 April 2012/Accepted: 4 September 2012/Published online: 28 September 2012.
Sonuparlak, B. 1994. Aluminum MMC electronic materials produced by pressureless metal infiltration. In Proceedings of Fifteenth and Sixteenth Annual Metal Matrix Composites Working Group Meetings, 243–257.
Sonuparlak, B. and C. Meyer. 1996. Silicon carbide reinforced aluminum for performance packages. In Proceedings of International Electronic Packaging Conference, IEPS Conference, Austin, TX.
Sonuparlak, B., and D. Andrews. 1998. Silicon carbide reinforced aluminum for performance thermal management applications. In PCIM International 98 Japan Proceedings, Tokyo, 185–194.
Author information
Authors and Affiliations
Corresponding author
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 2017 Springer International Publishing AG
About this chapter
Cite this chapter
Loutfy, K., Sonuparlak, B., Loutfy, R. (2017). High Thermal Conductivity Materials: Aluminum Diamond, Aluminum Silicon Carbide, and Copper Diamond. In: Kuang, K., Sturdivant, R. (eds) RF and Microwave Microelectronics Packaging II. Springer, Cham. https://doi.org/10.1007/978-3-319-51697-4_9
Download citation
DOI: https://doi.org/10.1007/978-3-319-51697-4_9
Published:
Publisher Name: Springer, Cham
Print ISBN: 978-3-319-51696-7
Online ISBN: 978-3-319-51697-4
eBook Packages: EngineeringEngineering (R0)