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Micro Speckle Stamping: High Contrast, No Basecoat, Repeatable, Well-Adhered

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Abstract

Micro Speckle Stamping has been developed and tested whereby repeatable micro speckle patterns for DIC are applied with no basecoat. The speckle patterns are created on a stamp, and ink is applied to the stamp. The user then transfers the speckle pattern from the stamp to the specimen. Micro Speckle Stamping uses high optical contrast and high electrical contrast speckle materials and leaves no residue between speckles. This new method is more amenable to applying patterns to complex surface geometries and large surface areas and also allows investigations of the virgin surface with EDS and EBSD.

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Acknowledgements

The authors thank Brian Wisner/Drexel for Fig. 34.1 SEM imaging and Prof. Michael Sangid/Purdue for DIC results

Author information

Authors and Affiliations

  1. 1900 Engineering, LLC, Clemson, SC, USA

    Andrew H. Cannon

  2. Department of Chemical and Biomolecular Engineering, Clemson University, Clemson, SC, USA

    Andrew H. Cannon

  3. NASA Langley Research Center: Durability, Damage Tolerance, and Reliability Branch, Hampton, VA, USA

    Jacob D. Hochhalter & Geoffrey F. Bomarito

  4. National Institute of Aerospace, Hampton, VA, USA

    Timothy Ruggles

Authors
  1. Andrew H. Cannon
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  2. Jacob D. Hochhalter
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  3. Geoffrey F. Bomarito
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  4. Timothy Ruggles
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Corresponding author

Correspondence to Andrew H. Cannon .

Editor information

Editors and Affiliations

  1. Department of Mechanical Engineering, University of South Carolina, Columbia, South Carolina, USA

    Michael Sutton

  2. Sandia National Laboratory, Albuquerque, New Mexico, USA

    Phillip L. Reu

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© 2017 The Society for Experimental Mechanics, Inc.

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Cannon, A.H., Hochhalter, J.D., Bomarito, G.F., Ruggles, T. (2017). Micro Speckle Stamping: High Contrast, No Basecoat, Repeatable, Well-Adhered. In: Sutton, M., Reu, P. (eds) International Digital Imaging Correlation Society. Conference Proceedings of the Society for Experimental Mechanics Series. Springer, Cham. https://doi.org/10.1007/978-3-319-51439-0_34

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  • DOI: https://doi.org/10.1007/978-3-319-51439-0_34

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  • Publisher Name: Springer, Cham

  • Print ISBN: 978-3-319-51438-3

  • Online ISBN: 978-3-319-51439-0

  • eBook Packages: EngineeringEngineering (R0)

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