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Surface Finish Effects on Fracture Behavior of Sn–4Ag–0.5Cu Solder Joints

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Book cover Mechanical and Creep Behavior of Advanced Materials

Part of the book series: The Minerals, Metals & Materials Series ((MMMS))

Abstract

The effect of various surface finishes on the interfacial fracture toughness of SAC405 solder joints under shock loading conditions was investigated using sandwich compact tension specimens. The surface finishes investigated in this study were organic solderability preservative (OSP), immersion silver (ImAg), nano-tin dispersed in an organic carrier (OrM), and gold over nickel (NiAu). It was found that the ImAg surface finish appears to enhance the fracture toughness, while the NiAu surface finish appears to have no effect compared to bare copper. For the OSP and OrM surface finishes, more data will need to be collected to reach a conclusion regarding their effect. The effects on fracture toughness could not be attributed to the thickness or morphology of the intermetallic compound layer found at the solder joint interface. Future work will focus on understanding the mechanisms by which immersion silver enhances the fracture toughness. Overall, the results of this study may help designers make more informed decisions about which surface finishes can be used to reduce shock failures in consumer electronic devices.

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Notes

  1. 1.

    Eutectic tin-lead solder is 61.9 wt% Sn and 37.1 wt% Pb with a melt pointing of 183 °C. Hereafter referred to as just SnPb.

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Acknowledgements

The authors gratefully acknowledge financial support from Intel Corporation and the Oregon Metals Initiative. Furthermore, the authors would like to thank Jim Kenny of Cookson Electronic for providing the surface finishes, Professor Tae-Kyu Lee of Portland State University for several useful discussions, and Joel Walenza-Slabe for helping with the aluminum evaporation.

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Authors and Affiliations

  1. Intel Corporation, Global Platform Analysis Center, Hillsboro, OR, 97124, USA

    Dick R. Casali

  2. Materials Science, School of Mechanical, Industrial, and Manufacturing Engineering, Oregon State University, Corvallis, OR, 97331, USA

    Dick R. Casali

  3. School of Mechanical and Manufacturing Engineering, UNSW Australia, Sydney, NSW, 2052, Australia

    Jamie J. Kruzic

Authors
  1. Dick R. Casali
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  2. Jamie J. Kruzic
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Corresponding author

Correspondence to Jamie J. Kruzic .

Editor information

Editors and Affiliations

  1. Dept of Chemical and Matls Engrg, University of Idaho Dept of Chemical and Matls Engrg, Moscow, Idaho, USA

    Indrajit Charit

  2. North Carolina State University , Raleigh, North Carolina, USA

    Yuntian T. Zhu

  3. Los Alamos National Laboratory , Los Alamos, New Mexico, USA

    Stuart A. Maloy

  4. University of Tennessee at Knoxville , KNOXVILLE, Tennessee, USA

    Peter K. Liaw

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© 2017 The Minerals, Metals & Materials Society

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Casali, D.R., Kruzic, J.J. (2017). Surface Finish Effects on Fracture Behavior of Sn–4Ag–0.5Cu Solder Joints. In: Charit, I., Zhu, Y., Maloy, S., Liaw, P. (eds) Mechanical and Creep Behavior of Advanced Materials. The Minerals, Metals & Materials Series. Springer, Cham. https://doi.org/10.1007/978-3-319-51097-2_19

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