Abstract
In the past two decades, wearable computing has brought together different fields of research as well as industry. The idea of wearing a computer as a part of the clothing led to an increased effort in both industry and research to seamlessly integrate electronics and textiles. Having significantly different properties, textiles and electronics pose a challenge to mechanical, material, textile and electronics engineers. To address these challenges, in this chapter, different levels of textile-electronics integration are analysed: fibre level, textile material level and garment level. At the fibre level, microelectronics (e.g. transistors and sensors) are either directly fabricated on fibres or bonded onto the fibres using a specialised fabrication process. At the level of the textile material, textile is manufactured using conventional and conductive fibres. In later steps, conductive fibres are modified and interfaced with electronics. At the garment level, textile is the substrate material and the integration happens on the surface of a garment. Embroidery technique, lamination or screen printing are used to integrate the electronics on the textile. The principles of textile-electronics integration are described using representative examples from state-of-the-art research.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
References
Jung, S., Lauterbach, C., Strasser, M., Weber, W.: ISSCC 2003 / SESSION 22 / TD: EMBEDDED TECHNOLOGIES / PAPER 22. 1. Enabling technologies for disappearing electronics in smart textiles. In: Proceedings of the 2003 IEEE International Solid-State Circuits Conference (2003)
Bonderover, E., Wagner, S.: A woven inverter circuit for e-textile applications. IEEE Electron Device Lett. 25(5), 295–297 (2004)
Lee, J., Subramanian, V.: Weave patterned organic transistors on fiber for e-textiles. IEEE Trans. Electron Devices 52(2), 269–275 (2005)
Yamashita, T., Miyake, K., Itoh, T.: Conductive polymer coated elastomer contact structure for woven electronic textile. Micro Electro Mech. 195, 408–411 (2012)
Cherenack, K., Zysset, C., Kinkeldei, T., Münzenrieder, N., Tröster, G.: Woven electronic fibers with sensing and display functions for smart textiles. Adv. Mater. (Deerfield Beach, Fla.) 22(45), 5178–5182 (2010)
Zysset, C., Nasseri, N., Büthe, L., Münzenrieder, N., Petti, L., Kleiser, S., Salvatore, G.A., Wolf, M., Tröster, G.: Textile integrated sensors and actuators for near-infrared spectroscopy. Opt. Express 21(3), 837–842 (2013)
Mattana, G., Kinkeldei, T.: Woven temperature and humidity sensors on flexible plastic substrates for e-textile applications. IEEE Sens. J. 13(10), 3901–3909 (2013)
Zysset, C., Kinkeldei, T., Muenzenrieder, N., Petti, L., Salvatore, G., Troester, G.: Combining electronics on flexible plastic strips with textiles. Text. Res. J. 83, 1130–1142 (2013)
Suo, Z., Gleskova, H., Wagner, S.: Mechanics of rollable and foldable film-on-foil electronics. Appl. Phys. Lett. 1177(1999), 129–132 (2007)
Brun, J., Vicard, D., Mourey, B., Lépine, B., Frassati, F.: Packaging and wired interconnections for insertion of miniaturized chips in smart fabrics. In: Microelectronics and Packaging Conference, 2009. EMPC 2009. European, IEEE, pp. 1–5 (2009)
Hamedi, M., Herlogsson, L., Crispin, X., Morcilla, R., Berggren, M., Inganas, O.: Fiber-embedded electrolyte-gated field effect transistor for e-textile. Adv. Mater. 21(5), 573–577 (2009)
Hamedi, M., Forchheimer, R., Inganäs, O.: Towards woven logic from organic electronic fibres. Nat. Mater. 6(5), 357–362 (2007)
Kinkeldei, T., Cherenack, K., Zysset, C., Woo, N., Tröster, G.: Crack prevention of highly bent metal thin films in woven electronic textiles. Eur. Phys. J. Appli. Phys. 55(2), 23901 (2011)
Kinkeldei, T., Munzenrieder, N., Zysset, C., Cherenack, K., Tröster, G.: Encapsulation for flexible electronic devices. IEEE Electron Device Lett. 32(12), 1743–1745 (2011)
Zhu, S., So, J.H., Mays, R., Desai, S., Barnes, W.R., Pourdeyhimi, B., Dickey, M.D.: Ultrastretchable fibers with metallic conductivity using a liquid metal alloy core. Adv. Funct. Mater. 23(18), 2308–2314 (2013)
Dickey, M.D., Chiechi, R.C., Larsen, R.J., Weiss, E.A., Weitz, D.A., Whitesides, G.M.: Eutectic gallium-indium (EGaIn): a liquid metal alloy for the formation of stable structures in microchannels at room temperature. Adv. Funct. Mater. 18(7), 1097–1104 (2008)
Li, L., Au, W., Li, Y., Wan, K.: Design of intelligent garment with transcutaneous electrical nerve stimulation function based on the intarsia knitting technique. Text. Res. J. 80(3), 279–286 (2009)
Locher, I., Troster, G.: Fundamental building blocks for circuits on textiles. IEEE Trans. Adv. Packag. 30(3), 541–550 (2007)
Li, Q., Tao, X.M.: Three-dimensionally deformable, highly stretchable, permeable, durable and washable fabric circuit boards. Proc. R. Soc. A 470, 20140472 (2014)
Bonderover, E., Wagner, S.: A woven inverter circuit for e-textile applications. IEEE Electron Device Lett. 25(5), 295–297 (2004)
Varga, M., Münzenrieder, N., Vogt, C., Tröster, G.: Programmable e-textile composite circuit. In: Electronic Components and Technology Conference, pp. 678–684 (2015)
Simon, E.P., Kallmayer, C., Schneider-Ramelow, M., Lang, K.D.: Development of a Multi-terminal crimp package for smart textile integration. In: 4th, IEEE Electronic System-Integration Technology Conference, pp. 1–6 (2012)
von Krshiwoblozki, M., Linz, T., Neudeck, A., Kallmayer, C.: Electronics in textiles adhesive bonding technology for reliably embedding electronic modules into textile circuits. Adv. Sci. Technol. 85, 1–10 (2012)
Buechley, L., Eisenberg, M.: Fabric PCBs, electronic sequins, and socket buttons: techniques for e-textile craft. Pers. Ubiquitous Comput. 13(2), 133–150 (2009)
Vervust, T., Buyle, G., Bossuyt, F., Vanfleteren, J.: Integration of stretchable and washable electronic modules for smart textile applications. J. Text. Inst. 103(10), 1127–1138 (2012)
Kim, D.H., Rogers, J.A.: Stretchable electronics: materials strategies and devices. Adv. Mater. 20(24), 4887–4892 (2008)
Kim, Y., Kim, H., Yoo, H.J.: Electrical characterization of screen-printed circuits on the fabric. IEEE Trans. Adv. Packag. 33(1), 196–205 (2010)
Yoo, J.: Planar-fabric circuit board and silicon-on-clothes for wearable healthcare applications. In: 2010 3rd International Symposium on Applied Sciences in Biomedical and Communication Technologies (ISABEL 2010), pp. 1–2 (2010)
Author information
Authors and Affiliations
Corresponding author
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 2017 Springer International Publishing AG
About this chapter
Cite this chapter
Varga, M. (2017). Electronics Integration. In: Schneegass, S., Amft, O. (eds) Smart Textiles. Human–Computer Interaction Series. Springer, Cham. https://doi.org/10.1007/978-3-319-50124-6_8
Download citation
DOI: https://doi.org/10.1007/978-3-319-50124-6_8
Published:
Publisher Name: Springer, Cham
Print ISBN: 978-3-319-50123-9
Online ISBN: 978-3-319-50124-6
eBook Packages: Computer ScienceComputer Science (R0)