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Thermal Properties and Thermal Analysis: Fundamentals, Experimental Techniques and Applications

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Springer Handbook of Electronic and Photonic Materials

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Abstract

The chapter provides a summary of the fundamental concepts that are needed to understand the heat capacity CP, thermal conductivity κ, and thermal expansion coefficient αL of materials. The CP, κ, and αL of various classes of materials, namely, semiconductors, polymers, and glasses, are reviewed, and various typical characteristics are summarized. A key concept in crystalline solids is the Debye theory of the heat capacity, which has been widely used for many decades for calculating the CP of crystals. The thermal properties are interrelated through Grüneisen’s theorem. Various useful empirical rules for calculating CP and κ have been used, some of which are summarized. Conventional differential scanning calorimetry (GlossaryTerm

DSC

) is a powerful and convenient thermal analysis technique that allows various important physical and chemical transformations, such as the glass transition, crystallization, oxidation, melting etc. to be studied. DSC can also be used to obtain information on the kinetics of the transformations, and some of these thermal analysis techniques are summarized. Temperature-modulated DSC, TMDSC, is a relatively recent innovation in which the sample temperature is ramped slowly and, at the same time, sinusoidally modulated. TMDSC has a number of distinct advantages compared with the conventional DSC since it measures the complex heat capacity. For example, the glass-transition temperature Tg measured by TMDSC has almost no dependence on the thermal history, and corresponds to an almost step life change in CP.

The new Tzero DSC has an additional thermocouple to calibrate better for thermal lags inherent in the DSC measurement, and allows more accurate thermal analysis.

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Acknowledgements

The authors thank Dr. Dancho Tonchev for many helpful discussions on thermal properties, and his invaluable contributions to the first edition of this chapter.

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Authors and Affiliations

  1. University of Saskatchewan, Saskatoon, Canada

    Safa Kasap

  2. Dept. of Physical Chemistry, University of Pardubice, Pardubice, Czech Republic

    Jiří Málek & Roman Svoboda

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  1. Safa Kasap
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  2. Jiří Málek
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Correspondence to Safa Kasap .

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Editors and Affiliations

  1. University of Saskatchewan, Saskatoon, Canada

    Safa Kasap

  2. Formerly with Leonardo MW Ltd, Southampton, UK

    Peter Capper

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Kasap, S., Málek, J., Svoboda, R. (2017). Thermal Properties and Thermal Analysis: Fundamentals, Experimental Techniques and Applications. In: Kasap, S., Capper, P. (eds) Springer Handbook of Electronic and Photonic Materials. Springer Handbooks. Springer, Cham. https://doi.org/10.1007/978-3-319-48933-9_19

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