Theoretical Basis of the Aboav-Weaire Equation and Topological Consequences

Abbruzzese, Giuseppe Carlo

doi:10.1007/978-3-319-48770-0_3

Giuseppe Carlo Abbruzzese⁷

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Abstract

The Aboav-Weaire (AW) equation [1,2] describes a topological correlation, in any 2-d grain microstructure, between the number of sides of a given grain m and the average number of sides of the first neighbours of the grain m.

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References

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Authors and Affiliations

Centro Sviluppo Materiali, Rome, Italy
Giuseppe Carlo Abbruzzese

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Giuseppe Carlo Abbruzzese
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Carnegie Mellon University, USA
Elizabeth A. Holm (Professor of Materials Science and Engineering), Gregory S. Rohrer Ph.D. & Anthony D. Rollett (Professor of Materials Science and Engineering) (Professor of Materials Science and Engineering), & (Professor of Materials Science and Engineering)
Research and Technology Center, U. S. Steel Corporation, USA
Susan Farjami (Senior research engineer) (Senior research engineer)
Robert Morris University, Pittsburgh, PA, USA
Priyadarshan Manohar (Associate Professor of Engineering and Co-Director Research and Outreach Center (ROC) (Associate Professor of Engineering and Co-Director Research and Outreach Center (ROC)
University of Pennsylvania, USA
Gregory S. Rohrer Ph.D. & David Srolovitz Ph.D. (Member of the National Academy of Engineering, Fellow of MRS, TMS, ASM, Institute of Physics) & (Member of the National Academy of Engineering, Fellow of MRS, TMS, ASM, Institute of Physics)
Rutgers University, USA
David Srolovitz Ph.D. (Member of the National Academy of Engineering, Fellow of MRS, TMS, ASM, Institute of Physics) (Member of the National Academy of Engineering, Fellow of MRS, TMS, ASM, Institute of Physics)
Alcoa Technical Center, Pittsburgh, PA, USA
Hasso Weiland (Technical Fellow) (Technical Fellow)

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Abbruzzese, G.C. (2016). Theoretical Basis of the Aboav-Weaire Equation and Topological Consequences. In: Holm, E.A., et al. Proceedings of the 6th International Conference on Recrystallization and Grain Growth (ReX&GG 2016). Springer, Cham. https://doi.org/10.1007/978-3-319-48770-0_3

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DOI: https://doi.org/10.1007/978-3-319-48770-0_3
Publisher Name: Springer, Cham
Print ISBN: 978-3-319-48626-0
Online ISBN: 978-3-319-48770-0
eBook Packages: Chemistry and Materials ScienceChemistry and Material Science (R0)

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