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Cleaning of Silica Surfaces by Surface Dielectric Barrier Discharge Plasma

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Recent Global Research and Education: Technological Challenges

Part of the book series: Advances in Intelligent Systems and Computing ((AISC,volume 519))

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Abstract

This work presents a simple and easy method of surface cleaning of silica substrates used for thin film depositions and preparation of microscopy samples. To this purpose, we use a surface dielectric barrier discharge (SDBD) in flow of dried air (relative humidity below 2 %) at atmospheric pressure. The silica substrates and SDBD electrodes were mounted face to face with a small gap (2 mm) through which was flown the working gas. The cleaning effectiveness was evaluated by measurements of water contact angle of the silica surfaces, which showed a decrease from 60° to >30° in 20 min of treatment.

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References

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Acknowledgments

This work was supported by CNCSIS, IDEI Research Program of Romanian Research, Development and Integration National Plan II, Grant no. 267/2011.

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Authors and Affiliations

  1. Faculty of Physics, Iasi Plasma Advanced Research Center (IPARC), Alexandru Ioan Cuza University of Iasi, Blvd. Carol I Nr. 11, Iasi, 700506, Romania

    Lucel Sirghi, Florentina Samoila & Viorel Anita

Authors
  1. Lucel Sirghi
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  2. Florentina Samoila
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  3. Viorel Anita
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Corresponding author

Correspondence to Lucel Sirghi .

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Editors and Affiliations

  1. Institute of Metrology and Biomedical En, Warsaw University of Technology Institute of Metrology and Biomedical En, Warsaw, Poland

    Ryszard Jabłoński

  2. Institute of Metrology and Biomedical En, Warsaw University of Technology Institute of Metrology and Biomedical En, Warsaw, Poland

    Roman Szewczyk

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Sirghi, L., Samoila, F., Anita, V. (2017). Cleaning of Silica Surfaces by Surface Dielectric Barrier Discharge Plasma. In: Jabłoński, R., Szewczyk, R. (eds) Recent Global Research and Education: Technological Challenges. Advances in Intelligent Systems and Computing, vol 519. Springer, Cham. https://doi.org/10.1007/978-3-319-46490-9_35

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  • DOI: https://doi.org/10.1007/978-3-319-46490-9_35

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  • Publisher Name: Springer, Cham

  • Print ISBN: 978-3-319-46489-3

  • Online ISBN: 978-3-319-46490-9

  • eBook Packages: EngineeringEngineering (R0)

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