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Lessons Learned from Tool Integration with OSLC

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Part of the book series: Communications in Computer and Information Science ((CCIS,volume 639))

Abstract

Today’s embedded and cyber-physical systems are getting more connected and complex. One main challenge during development is the often loose coupling between engineering tools, which could lead to inconsistencies and errors due to the manual transfer and duplication of data. Open formats and specifications raise expectations for seamlessly integrated tool chains for systems engineering combining best-of-breed technologies and tools of different tool vendors.

The ARTEMIS JU project CRYSTAL aims for a harmonized interoperability specification (IOS) incorporating various open specifications and standards such as OSLC (Open Services for Lifecycle Collaboration), ReqIF (Requirements Interchange Format) or FMI (Functional Mockup Interface) for supporting seamless model-based systems engineering.

This paper focuses on lifecycle integration using OSLC. We will report challenges we experienced in the implementation of an automotive and healthcare use case. The paper should support others in deciding if OSLC is an appropriate technology and to overcome common challenges in the implementation of OSLC adapters.

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References

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Acknowledgment

The research leading to these results has received partial funding from the European Union’s Seventh Framework Program (FP7/2007-2013) for CRYSTAL - Critical System Engineering Acceleration Joint Undertaking under grant agreement No 332830 and from Vinnova under DIARIENR 2012-04304. Further, the authors gratefully acknowledge financial support from FFG Austria for the project in which the above presented research results were achieved.

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Correspondence to Andrea Leitner .

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© 2016 Springer International Publishing Switzerland

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Leitner, A., Herbst, B., Mathijssen, R. (2016). Lessons Learned from Tool Integration with OSLC. In: Dregvaite, G., Damasevicius, R. (eds) Information and Software Technologies. ICIST 2016. Communications in Computer and Information Science, vol 639. Springer, Cham. https://doi.org/10.1007/978-3-319-46254-7_20

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  • DOI: https://doi.org/10.1007/978-3-319-46254-7_20

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  • Publisher Name: Springer, Cham

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