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Flip-Chip Underfill: Materials, Process, and Reliability

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Materials for Advanced Packaging

Abstract

In order to enhance the reliability of a flip-chip on organic board package, underfill is usually used to redistribute the thermo-mechanical stress created by the Coefficient of Thermal Expansion (CTE) mismatch between the silicon chip and organic substrate. However, the conventional underfill relies on the capillary flow of the underfill material and has many disadvantages. In order to overcome these disadvantages, many variations have been invented to improve the flip-chip underfill process. This chapter reviews the recent advances in the material design, process development, and reliability issues of flip-chip underfill, especially in no-flow underfill, molded underfill, and wafer-level underfill. The relationship between the materials, process, and reliability in these packages is discussed.

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Authors and Affiliations

  1. HP Inc., Corvallis, OR, 97330, USA

    Zhuqing Zhang Ph.D.

  2. Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, Shenzhen, China

    Pengli Zhu Ph.D.

  3. Georgia Institute of Technology, Atlanta, GA, 30332-0245, USA

    C. P. Wong Ph.D.

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  1. Zhuqing Zhang Ph.D.
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  2. Pengli Zhu Ph.D.
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  3. C. P. Wong Ph.D.
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Correspondence to Zhuqing Zhang Ph.D. .

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Editors and Affiliations

  1. Henkel China Co., Ltd, Shanghai, Shanghai, China

    Daniel Lu

  2. Materials Science and Engineering, Georgia Institute of Technology, Atlanta, Georgia, USA

    C.P. Wong

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Zhang, Z., Zhu, P., Wong, C.P. (2017). Flip-Chip Underfill: Materials, Process, and Reliability. In: Lu, D., Wong, C. (eds) Materials for Advanced Packaging. Springer, Cham. https://doi.org/10.1007/978-3-319-45098-8_8

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