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Materials for Advanced Packaging pp 287–329Cite as

Advanced Substrates: A Materials and Processing Perspective

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Abstract

This chapter reviews materials and processing for fabricating organic substrates including laminate substrates for plastic BGA (PBGA), buildup substrates for flip chip BGA (FCBGA), tape substrates for tape BGA (TBGA), coreless substrates, and some specialty substrates such as substrates for RF modules, high performance substrates with low dielectric constant dielectrics, and substrate with embedded components (active dies and/or passives). Future trends of organic substrate development are covered in this chapter as well.

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Trademarks

  • aEASI and aS3 are trademarks of Advanced Semiconductor Engineering Inc.

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  • ALIVH is a registered trademark of Matsushita Electric Industrial Co., Ltd.

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  • B2iT is a trademark of Toshiba Corp.

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  • DuPont and Vacrel are registered trademarks of E. I. du Pont de Nemours and Co.

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  • ECP is a registered trademark of Austria Technologie und Systemtechnik A.G.

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  • Microlam was a registered trademark of W. L. Gore and Associates, Inc.

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  • HyperBGA is a registered trademark of i3 Electronics, Inc.

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  • Virtex is a registered trademark of Xilinx, Inc.

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Acknowledgment

I would like to recognize Dora Lee of ASE in Kaohsiung and Dr. Kay Essig of ASE Europe for their support in composing this chapter.

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Authors and Affiliations

  1. retired, formerly ASE (U.S.) Inc., 1255 E. Arques, Sunnyvale, CA, 94085, USA

    Bernd K. Appelt

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  1. Bernd K. Appelt
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Correspondence to Bernd K. Appelt .

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Editors and Affiliations

  1. Henkel China Co., Ltd, Shanghai, Shanghai, China

    Daniel Lu

  2. Materials Science and Engineering, Georgia Institute of Technology, Atlanta, Georgia, USA

    C.P. Wong

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Appelt, B.K. (2017). Advanced Substrates: A Materials and Processing Perspective. In: Lu, D., Wong, C. (eds) Materials for Advanced Packaging. Springer, Cham. https://doi.org/10.1007/978-3-319-45098-8_7

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  • DOI: https://doi.org/10.1007/978-3-319-45098-8_7

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  • Publisher Name: Springer, Cham

  • Print ISBN: 978-3-319-45097-1

  • Online ISBN: 978-3-319-45098-8

  • eBook Packages: EngineeringEngineering (R0)

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