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Materials for Advanced Packaging pp 469–510Cite as

Die Attach Adhesives and Films

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Abstract

This chapter outlines the strong correlation between developments in electronic packaging technologies and required properties of die attach materials. An overview of die attach materials is summarized with the trends in the market. Die attach paste, adhesive tape for a lead on chip (LOC), die attach film, and the prospects of advanced die attach film are described in each section. The technical requirements of the die attach materials, which include high purity, fast curing, low stress, high package crack resistance, and multi-chip packaging are discussed.

Die attach films have become the main stream of die attach materials owing to their excellent properties and reliability. The future of advanced die attach films is explained with the introduction of adhesive film with dicing/die attach dual functionality.

The effects of adhesive properties such as peel strength and water absorption to improve package crack resistance are reported in detail. The development of die attach films with micro-phase separation structure for multi-layered packaging process is reviewed. Evaluation of die attach materials for next generation packages is also introduced.

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Authors and Affiliations

  1. Hitachi Chemical Co., Ltd., 9-2 Marunouchi 1-chome, Chiyoda-ku, Tokyo, 100-0066, Japan

    Shinji Takeda, Takashi Masuko, Nozomu Takano & Teiichi Inada

Authors
  1. Shinji Takeda
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  2. Takashi Masuko
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  3. Nozomu Takano
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  4. Teiichi Inada
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Corresponding author

Correspondence to Shinji Takeda .

Editor information

Editors and Affiliations

  1. Henkel China Co., Ltd, Shanghai, Shanghai, China

    Daniel Lu

  2. Materials Science and Engineering, Georgia Institute of Technology, Atlanta, Georgia, USA

    C.P. Wong

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Takeda, S., Masuko, T., Takano, N., Inada, T. (2017). Die Attach Adhesives and Films. In: Lu, D., Wong, C. (eds) Materials for Advanced Packaging. Springer, Cham. https://doi.org/10.1007/978-3-319-45098-8_11

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  • DOI: https://doi.org/10.1007/978-3-319-45098-8_11

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  • Publisher Name: Springer, Cham

  • Print ISBN: 978-3-319-45097-1

  • Online ISBN: 978-3-319-45098-8

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