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Fundamentals of Thermal Compression Bonding Technology and Process Materials for 2.5/3D Packages

  • Sangil LeeEmail author
Chapter
Part of the Springer Series in Advanced Microelectronics book series (MICROELECTR., volume 57)

Abstract

This chapter reviews bonding technology, which would be most problematic among technical challenges, to provide engineering sciences and fundamentals of the bonding technology and process materials. The in situ bonding technology termed as Thermal Compression Bonding (TCB) typically controls force, temperature, and displacement, which are applied to packages when to reflow microbump solder interconnect of 3D TSV die. Consequently, this chapter would help to understand how to design assembly building blocks adequate to the configuration of packages.

Keywords

Solder Bump Flip Chip Electroless Nickel Immersion Gold Bonding Technology Reflow Process 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

Notes

Acknowledgement

The editors would like to thank Paul Vianco from Sandia National Laboratory, Yonghao Xiu and Yuying Wei from Intel Corporation for their critical review of this chapter.

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Copyright information

© Springer International Publishing Switzerland 2017

Authors and Affiliations

  1. 1.Invensas CorporationSan JoseUSA

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