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Interconnect Quality and Reliability of 3D Packaging

  • Yaodong Wang
  • Yingxia Liu
  • Menglu Li
  • K. N. Tu
  • Luhua XuEmail author
Chapter
Part of the Springer Series in Advanced Microelectronics book series (MICROELECTR., volume 57)

Abstract

Quality and reliability aspects of 3D IC and packages are discussed in this chapter. The main focuses are interconnects-related quality and reliability issues. For the 3D packages, interconnects may include microbump, TSV, UBM, copper traces, etc. We compare them to the quality and reliability concerns observed in the existing interconnects, as well as the methodology to predict the field performances. We shall cover microstructure changes and failures driven by mechanical stressing, electromigration (EM), and thermomigration (TM). This way we can see how the transition, for example, from C-4 joints to microbumps may affect the failure modes. On mechanical stressing, we emphasize the brittle nature as well as microvoid formation, especially Kirkendall void formation in microbumps. A string of voids in a brittle material can easily lead to fracture damage. The interest in mechanical failures is because for mobile and wearable devices, the frequency of impact and dropping to the ground is high. On EM and TM in microbumps and TSV, we emphasize the enhanced failure mode due to Joule heating.

Keywords

Solder Joint Joule Heating Solder Bump Back Stress Under Bump Metallurgy 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

Notes

Acknowledgment

The editors would like to thank Indranath Dutta from Washington State University and Tae-Kyu Lee from Portland State University for their critical review of this chapter.

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Copyright information

© Springer International Publishing Switzerland 2017

Authors and Affiliations

  • Yaodong Wang
    • 1
  • Yingxia Liu
    • 1
  • Menglu Li
    • 1
  • K. N. Tu
    • 1
  • Luhua Xu
    • 2
    Email author
  1. 1.Department of Materials Science and EngineeringUniversity of California, Los Angeles (UCLA)Los AngelesUSA
  2. 2.Intel CorporationChandlerUSA

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