Fundamentals of Heat Dissipation in 3D IC Packaging

  • Satish G. KandlikarEmail author
  • Amlan Ganguly
Part of the Springer Series in Advanced Microelectronics book series (MICROELECTR., volume 57)


Cooling of a planar 2D IC chip utilizes heat transfer from a face of the chip through a heat sink. In case of a 3D IC chip stack, the individual chip faces are not available for mounting conventional heat sinks. Mounting the heat sinks on the ends is feasible, but the heat flow paths for the interior chips from the junction to the heat sink become longer. Further, multiple heat sources present along the heat flow paths in stacked chips may create localized hot spots which exceed the allowable junction temperatures. Introducing interlayer cooling with microchannels and introducing fins in the coolant flow paths extend the thermal dissipation capability of a 3D stack; however, this is often accompanied with taller microchannels that lead to longer lengths of through-silicon-vias (TSVs). Placement of TSVs, microchannels walls, and fins present conflicting design requirements. Therefore codesign and innovative approaches are seen as critical before widespread commercialization of 3D ICs becomes a reality. An overview of the available cooling options for 3D ICs and their performance evaluation are presented in this chapter.


Heat Sink Spray Cool Coolant Flow Rate Task Migration Compact Heat Exchanger 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.



The editors would like to thank Songhua Shi from Medtronic and Ravi Mahajan from Intel Corporation for their critical review of this chapter.


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Copyright information

© Springer International Publishing Switzerland 2017

Authors and Affiliations

  1. 1.Mechanical Engineering DepartmentRochester Institute of TechnologyRochesterUSA
  2. 2.Computer Engineering DepartmentRochester Institute of TechnologyRochesterUSA

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