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Introduction to 3D Microelectronic Packaging

  • Yan LiEmail author
  • Deepak Goyal
Chapter
Part of the Springer Series in Advanced Microelectronics book series (MICROELECTR., volume 57)

Abstract

Advanced 3D microelectronic packaging technology has been employed to meet portable electronics demand of ultra-thin, ultra-light, high performance with low power consumption. It also opens up a new dimension for the semiconductor industry to maintain Moore’s law with a much lower cost. Motivations as well as various architectures of 3D packaging are illustrated. Challenges in 3D packaging, including fabrication, assembly, cost, design, modeling, thermal management, material, substrate, quality, reliability, and failure analysis, are reviewed with brief introduction to the chapters addressing these challenges.

Keywords

Solder Joint Graphic Processing Unit Dynamic Random Access Memory Fault Isolation Small Form Factor 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

Notes

Acknowledgement

The editors would like to thank John Elmer from Lawrence Livermore National Laboratory for his critical review of this chapter.

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Copyright information

© Springer International Publishing Switzerland 2017

Authors and Affiliations

  1. 1.Intel CorporationChandlerUSA

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