Abstract
In this section, we present a general survey of the theories and models that have been used to describe dielectric breakdown in amorphous thin films. The fundamental concepts for each theory are presented as initially proposed by the authors. Some of the models explained in this section include the E, 1/E, \( \sqrt{E} \), power-law, and the metal-catalyzed failure model. Commentary on the limitations for each model is provided. In the latter part of this chapter, we will discuss the most recent models for describing reliability trends in contemporary interconnect structures that employ low-κ nano-porous films. A general comparison between model predictions at low field is presented.
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References
Achanta, R. S., Gill, W. N., & Plawsky, J. L. (2008). Copper ion drift in integrated circuits: Effect of boundary conditions on reliability and breakdown of low-κ dielectrics. Journal of Applied Physics, 103(1), 014907–014907.6.
Achanta, R., & McLaughlin, P. (2011, April). A charge transport based acceleration model for interlevel dielectric breakdown. In 2011 I.E. International Reliability Physics Symposium (IRPS) (pp. BD.2.1–BD.2.5). IEEE, Piscataway, NJ.
Achanta, R., & McLaughlin, P. (2014). A charge transport model for SiCOH dielectric breakdown in copper interconnects and its applications. IEEE Transactions on Device and Materials Reliability, 14(1), 133–138.
Achanta, R. S., Plawsky, J. L., & Gill, W. N. (2007). A time dependent dielectric breakdown model for field accelerated low-κ breakdown due to copper ions. Applied Physics Letters, 91(23), 234106–234106.3.
Allers, K. H. (2004). Prediction of dielectric reliability from I- V characteristics: Poole–Frenkel conduction mechanism leading to E1/2 model for silicon nitride MIM capacitor. Microelectronics Reliability, 44(3), 411–423.
Anolick, E. S., & Nelson, G. R. (1980). Low-field time-dependent dielectric integrity. IEEE Transactions on Reliability, 29(3), 217–221.
Chen, F., Bravo, O., Chanda, K., McLaughlin, P., Sullivan, T., Gill, J., … Aitken, J. (2006, March). A comprehensive study of low-κ SiCOH TDDB phenomena and its reliability lifetime model development. In 44th Annual, IEEE International Reliability Physics Symposium Proceedings, 2006 (pp. 46–53). IEEE, Piscataway, NJ.
Chen, I. C., Holland, S. E., & Hu, C. (1985a). Electrical breakdown in thin gate and tunneling oxides. IEEE Journal of Solid-State Circuits, 20(1), 333–342.
Chen, I. C., Holland, S., & Hut, C. (1985b, March). A quantitative physical model for time- dependent breakdown in SiO2. In 23rd Annual Reliability Physics Symposium, 1985 (pp. 24–31). IEEE, Piscataway, NJ.
Chery, E., Federspiel, X., Roy, D., Volpi, F., & Chaix, J. M. (2013). Identification of the (E1/2 + 1/E)-dependence of porous low-κ time dependent dielectric breakdown using over one year long package level tests. Microelectronic Engineering, 109, 90–93.
Dumin, D. J. (2002). Oxide reliability a summary of silicon oxide wear out, breakdown, and reliability. River Edge, NJ: World Scientific.
Haase, G. S. (2009). A model for electric degradation of interconnect low-κ dielectrics in microelectronic integrated circuits. Journal of Applied Physics, 105(4), 044908–044908.10.
Lloyd, J. R., Liniger, E., & Shaw, T. M. (2005). Simple model for time-dependent dielectric breakdown in inter-and intralevel low-κ dielectrics. Journal of Applied Physics, 98(8), 084109–084109.6.
Lloyd, J. R., Murray, C. E., Ponoth, S., Cohen, S., & Liniger, E. (2006). The effect of Cu diffusion on the TDDB behavior in a low-κ interlevel dielectrics. Microelectronics Reliability, 46(9), 1643–1647.
McPherson, J. W., Khamankar, R. B., & Shanware, A. (2000). Complementary model for intrinsic time-dependent dielectric breakdown in SiO2 dielectrics. Journal of Applied Physics, 88(9), 5351–5359.
McPherson, J. W., & Mogul, H. C. (1998). Underlying physics of the thermochemical E model in describing low-field time-dependent dielectric breakdown in SiO2 thin films. Journal of Applied Physics, 84(3), 1513–1523.
Schuegraf, K. F., & Hu, C. (1994). Hole injection SiO2 breakdown model for very low voltage lifetime extrapolation. IEEE Transactions on Electron Devices, 41(5), 761–767.
Suñé, J., & Wu, E. Y. (2004). Hydrogen-release mechanisms in the breakdown of thin SiO2 films. Physical Review Letters, 92(8), 087601–087601.4.
Suzumura, N., Yamamoto, S., Kodama, D., Makabe, K., Komori, J., Murakami, E., … Kubota, K. (2006, March). A new TDDB degradation model based on Cu ion drift in Cu interconnect dielectrics. In 44th Annual, IEEE International Reliability Physics Symposium Proceedings, 2006 (pp. 484–489). IEEE, Piscataway, NJ.
Wu, E. Y., & Suñé, J. (2005). Power-law voltage acceleration: A key element for ultra-thin gate oxide reliability. Microelectronics Reliability, 45(12), 1809–1834.
Zhao, L., Tőkei, Z., Croes, K., Wilson, C. J., Baklanov, M., Beyer, G. P., & Claeys, C. (2011). Direct observation of the 1/E dependence of time dependent dielectric breakdown in the presence of copper. Applied Physics Letters, 98(3), 032107–032107.3.
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Borja, J.P., Lu, TM., Plawsky, J. (2016). General Theories. In: Dielectric Breakdown in Gigascale Electronics. SpringerBriefs in Materials. Springer, Cham. https://doi.org/10.1007/978-3-319-43220-5_2
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DOI: https://doi.org/10.1007/978-3-319-43220-5_2
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