Abstract
As a versatile tool, transfer printing provides routes to assemble micro- and nano-structures onto functional substrates, with promising applications ranging from stretchable electronics in diagnostic/therapeutic platforms and human-machine interfaces to dissolvable devices in bio-implants and environmentally benign sensors. The conventional process involves pickup of micro-devices from their fabricated substrates, followed by delivery onto the target substrate of interest. This chapter summarizes the fundamental mechanics and materials aspects of transfer printing, as well as recent developments in advanced techniques that allow for applications in systems with varying levels of complexity. The opportunities and challenges on emerging use for cyber-manufacturing systems are also discussed.
Varun Ravikumar and Ning Yi—These authors contributed equally to this work.
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Rajkumar RR, Lee I, Sha L, Stankovic J (2010) Cyber-physical systems: the next computing revolution. In: Proceedings of the 47th design automation conference, pp 731–736
Wolf M (2014) High-performance embedded computing: applications in cyber-physical systems and mobile computing. Newnes
Lohr S (2012) The age of big data. New York Times, vol 11
Kagermann H, Helbig J, Hellinger A, Wahlster W (2013) Recommendations for implementing the strategic initiative INDUSTRIE 4.0: securing the future of german manufacturing industry; final report of the Industrie 4.0 working group, Forschungsunion
Shipp SS, Gupta N, Lal B, Scott JA, Weber CL, Finnin MS et al (2012) Emerging global trends in advanced manufacturing, DTIC Document
Gibson I, Rosen DW, Stucker B (2010) Additive manufacturing technologies. Springer, US
Huang Y, Leu MC (2014) Frontiers of additive manufacturing research and education
Kim D-H, Lu N, Ma R, Kim Y-S, Kim R-H, Wang S et al (2011) Epidermal electronics. Science 333:838–843
Kang S-K, Murphy RK, Hwang S-W, Lee SM, Harburg DV, Krueger NA et al (2016) Bioresorbable silicon electronic sensors for the brain. Nature 530:71–76
Jeong JW, Yeo WH, Akhtar A, Norton JJ, Kwack YJ, Li S et al (2013) Materials and optimized designs for human-machine interfaces via epidermal electronics. Adv Mater 25:6839–6846
Ying M, Bonifas AP, Lu N, Su Y, Li R, Cheng H et al (2012) Silicon nanomembranes for fingertip electronics. Nanotechnology 23:344004
Rogers JA, Someya T, Huang YG (2010) Materials and mechanics for stretchable electronics. Science 327:1603–1607
Kim DH, Song JZ, Choi WM, Kim HS, Kim RH, Liu ZJ et al (2008) Materials and noncoplanar mesh designs for integrated circuits with linear elastic responses to extreme mechanical deformations. Proc Natl Acad Sci USA 105:18675–18680
Kim DH, Ahn JH, Choi WM, Kim HS, Kim TH, Song JZ et al (2008) Stretchable and foldable silicon integrated circuits. Science 320:507–511
Kang I, Schulz MJ, Kim JH, Shanov V, Shi D (2006) A carbon nanotube strain sensor for structural health monitoring. Smart Mater Struct 15:737
Carlson A, Bowen AM, Huang Y, Nuzzo RG, Rogers JA (2012) Transfer printing techniques for materials assembly and micro/nanodevice fabrication. Adv Mater 24:5284–5318
Feng X, Meitl MA, Bowen AM, Huang Y, Nuzzo RG, Rogers JA (2007) Competing fracture in kinetically controlled transfer printing. Langmuir 23:12555–12560
Meitl MA, Zhu ZT, Kumar V, Lee KJ, Feng X, Huang YY et al (2006) Transfer printing by kinetic control of adhesion to an elastomeric stamp. Nat Mater 5:33–38
Anderson TL, Anderson T (2005) Fracture mechanics: fundamentals and applications. CRC press, Boca Raton
Carlson A, Kim-Lee H-J, Wu J, Elvikis P, Cheng H, Kovalsky A et al (2011) Shear-enhanced adhesiveless transfer printing for use in deterministic materials assembly. Appl Phys Lett 98:264104
Feng X, Cheng H, Bowen AM, Carlson AW, Nuzzo RG, Rogers JA (2013) A finite-deformation mechanics theory for kinetically controlled transfer printing. J Appl Mech 80:061023
Cheng H, Li M, Wu J, Carlson A, Kim S, Huang Y et al (2013) A viscoelastic model for the rate effect in transfer printing. J Appl Mech 80:041019
Chen H, Feng X, Huang Y, Huang Y, Rogers JA (2013) Experiments and viscoelastic analysis of peel test with patterned strips for applications to transfer printing. J Mech Phys Solids 61:1737–1752
Kim TH, Carlson A, Ahn JH, Won SM, Wang SD, Huang YG et al (2009) Kinetically controlled, adhesiveless transfer printing using microstructured stamps. Appl Phys Lett 94:113502
Li R, Li Y, Lü C, Song J, Saeidpourazar R, Fang B et al (2012) Thermo-mechanical modeling of laser-driven non-contact transfer printing: two-dimensional analysis. Soft Matter 8:3122–3127
Li R, Li Y, Lü C, Song J, Saeidpourazar R, Fang B et al (2012) Axisymmetric thermo-mechanical analysis of laser-driven non-contact transfer printing. Int J Fract 176:189–194
Saeidpourazar R, Sangid MD, Rogers JA, Ferreira PM (2012) A prototype printer for laser driven micro-transfer printing. J Manuf Process 14:416–424
Carlson A, Wang S, Elvikis P, Ferreira PM, Huang Y, Rogers JA (2012) Active, programmable elastomeric surfaces with tunable adhesion for deterministic assembly by transfer printing. Adv Funct Mater 22:4476–4484
Kim S, Wu JA, Carlson A, Jin SH, Kovalsky A, Glass P et al (2010) Microstructured elastomeric surfaces with reversible adhesion and examples of their use in deterministic assembly by transfer printing. Proc Natl Acad Sci USA 107:17095–17100
Cheng H, Wu J, Yu Q, Kim-Lee H-J, Carlson A, Turner KT et al (2012) An analytical model for shear-enhanced adhesiveless transfer printing. Mech Res Commun 43:46–49
Liao L, Bai J, Qu Y, Lin Y-C, Li Y, Huang Y et al (2010) High-κ oxide nanoribbons as gate dielectrics for high mobility top-gated graphene transistors. Proc Natl Acad Sci 107:6711–6715
Kim T-I, Lee SH, Li Y, Shi Y, Shin G, Lee SD et al (2014) Temperature-and size-dependent characteristics in ultrathin inorganic light-emitting diodes assembled by transfer printing. Appl Phys Lett 104:051901
Yoon J, Baca AJ, Park SI, Elvikis P, Geddes JB, Li LF et al (2008) Ultrathin silicon solar microcells for semitransparent, mechanically flexible and microconcentrator module designs. Nat Mater 7:907–915
Kim RH, Bae MH, Kim DG, Cheng H, Kim BH, Kim DH et al (2011) Stretchable, transparent graphene interconnects for arrays of microscale inorganic light emitting diodes on rubber substrates. Nano Lett 11:3381–3886
Chanda D, Shigeta K, Gupta S, Cain T, Carlson A, Mihi A et al (2011) Large-area flexible 3D optical negative index metamaterial formed by nanotransfer printing. Nat Nanotechnol 6:402–407
Furman B, Menard E, Gray A, Meitl M, Bonafede S, Kneeburg D et al (2010) A high concentration photovoltaic module utilizing micro-transfer printing and surface mount technology. In: 2010 35th IEEE Photovoltaic Specialists Conference (PVSC), pp 000475–000480
Kim J, Banks A, Cheng H, Xie Z, Xu S, Jang KI et al (2015) Epidermal electronics with advanced capabilities in near—field communication. small 11:906–912
Hattori Y, Falgout L, Lee W, Jung SY, Poon E, Lee JW et al (2014) Multifunctional skin-like electronics for quantitative, clinical monitoring of cutaneous wound healing. Adv Healthc Mater 3:1597–1607
Norton JJ, Lee DS, Lee JW, Lee W, Kwon O, Won P et al (2015) Soft, curved electrode systems capable of integration on the auricle as a persistent brain–computer interface. Proc Natl Acad Sci 112:3920–3925
Lee TW, Zaumseil J, Bao ZN, Hsu JWP, Rogers JA (2004) Organic light-emitting diodes formed by soft contact lamination. Proc Natl Acad Sci USA 101:429–433
Sekitani T, Nakajima H, Maeda H, Fukushima T, Aida T, Hata K et al (2009) Stretchable active-matrix organic light-emitting diode display using printable elastic conductors. Nat Mater 8:494–499
Sekitani T, Noguchi Y, Hata K, Fukushima T, Aida T, Someya T (2008) A rubberlike stretchable active matrix using elastic conductors. Science 321:1468–1472
Hwang SW, Kim DH, Tao H, Kim Ti, Kim S, Yu KJ et al (2013) Materials and fabrication processes for transient and bioresorbable high-performance electronics. Adv Funct Mater 23:4087–4093
Khang DY, Jiang HQ, Huang Y, Rogers JA (2006) A stretchable form of single-crystal silicon for high-performance electronics on rubber substrates. Science 311:208–212
Viventi J, Kim DH, Moss JD, Kim YS, Blanco JA, Annetta N et al (2010) A conformal, bio-interfaced class of silicon electronics for mapping cardiac electrophysiology. Sci Transl Med 2:24ra22
Sun YG, Choi WM, Jiang HQ, Huang YGY, Rogers JA (2006) Controlled buckling of semiconductor nanoribbons for stretchable electronics. Nat Nanotechnol 1:201–207
Cheng H, Song J (2013) A simply analytic study of buckled thin films on compliant substrates. J Appl Mech 81:024501
Cheng H, Zhang Y, Hwang K-C, Rogers JA, Huang Y (2014) Buckling of a stiff thin film on a pre-strained bi-layer substrate. Int J Solids Struct 51:3113–3118
Liu Z, Cheng H, Wu J (2014) Mechanics of solar module on structured substrates. J Appl Mech 81:064502
Zhang Y, Fu H, Su Y, Xu S, Cheng H, Fan JA et al (2013) Mechanics of ultra-stretchable self-similar serpentine interconnects. Acta Mater 61:7816–7827
Xu S, Zhang Y, Cho J, Lee J, Huang X, Jia L et al (2013) Stretchable batteries with self-similar serpentine interconnects and integrated wireless recharging systems. Nat Commun 4:1543
Jeong JW, Kim MK, Cheng H, Yeo WH, Huang X, Liu Y et al (2014) Capacitive epidermal electronics for electrically safe, long-term electrophysiological measurements. Adv Healthc Mater 3:642–648
Honda W, Harada S, Arie T, Akita S, Takei K (2014) Wearable, human-interactive, health-monitoring, wireless devices fabricated by macroscale printing techniques. Adv Funct Mater 24:3299–3304
Son D, Lee J, Qiao S, Ghaffari R, Kim J, Lee JE et al (2014) Multifunctional wearable devices for diagnosis and therapy of movement disorders. Nat Nanotechnol 9:397–404
Dagdeviren C, Hwang SW, Su Y, Kim S, Cheng H, Gur O et al (2013) Transient, biocompatible electronics and energy harvesters based on ZnO. Small 9:3398–3404
Dagdeviren C, Yang BD, Su Y, Tran PL, Joe P, Anderson E et al (2014) Conformal piezoelectric energy harvesting and storage from motions of the heart, lung, and diaphragm. Proc Natl Acad Sci 111:1927–1932
Lee M, Chen CY, Wang S, Cha SN, Park YJ, Kim JM et al (2012) A hybrid piezoelectric structure for wearable nanogenerators. Adv Mater 24:1759–1764
Webb RC, Bonifas AP, Behnaz A, Zhang Y, Yu KJ, Cheng H et al (2013) Ultrathin conformal devices for precise and continuous thermal characterization of human skin. Nat Mater 12:938–944
Xu L, Gutbrod SR, Bonifas AP, Su Y, Sulkin MS, Lu N et al (2014) 3D multifunctional integumentary membranes for spatiotemporal cardiac measurements and stimulation across the entire epicardium. Nat Commun 5:3329
Fan JA, Yeo WH, Su Y, Hattori Y, Lee W, Jung SY et al (2014) Fractal design concepts for stretchable electronics. Nat Commun 5:3266
Yamada T, Hayamizu Y, Yamamoto Y, Yomogida Y, Izadi-Najafabadi A, Futaba DN et al (2011) A stretchable carbon nanotube strain sensor for human-motion detection. Nat Nanotechnol 6:296–301
Shi J, Li X, Cheng H, Liu Z, Zhao L, Yang T et al (2016) Graphene reinforced carbon nanotube networks for wearable strain sensors. Adv Funct Mater
Huang X, Cheng H, Chen K, Zhang Y, Zhang Y, Liu Y et al (2013) Epidermal impedance sensing sheets for precision hydration assessment and spatial mapping. IEEE Trans Biomed Eng 60:2848–2857
Huang X, Liu Y, Cheng H, Shin WJ, Fan JA, Liu Z et al (2014) Materials and designs for wireless epidermal sensors of hydration and strain. Adv Funct Mater 24:3846–3854
Cheng H, Zhang Y, Huang X, Rogers JA, Huang Y (2013) Analysis of a concentric coplanar capacitor for epidermal hydration sensing. Sens Actuators A Phys 203:149–153
Jang KI, Han SY, Xu S, Mathewson KE, Zhang Y, Jeong JW et al (2014) Rugged and breathable forms of stretchable electronics with adherent composite substrates for transcutaneous monitoring. Nat Commun 5:4779
Ko HC, Stoykovich MP, Song JZ, Malyarchuk V, Choi WM, Yu CJ et al (2008) A hemispherical electronic eye camera based on compressible silicon optoelectronics. Nature 454:748–753
Wang SD, Xiao JL, Song JZ, Ko HC, Hwang KC, Huang YG et al (2010) Mechanics of curvilinear electronics. Soft Matter 6:5757–5763
Jang K-I, Chung HU, Xu S, Lee CH, Luan H, Jeong J et al (2015) Soft network composite materials with deterministic and bio-inspired designs. Nat Commun 6
Ko HC, Shin G, Wang SD, Stoykovich MP, Lee JW, Kim DH et al (2009) Curvilinear electronics formed using silicon membrane circuits and elastomeric transfer elements. Small 5:2703–2709
Yu KJ, Kuzum D, Hwang S-W, Kim BH, Juul H, Kim NH et al (2016) Bioresorbable silicon electronics for transient spatiotemporal mapping of electrical activity from the cerebral cortex. Nat Mater
Hwang S-W, Lee CH, Cheng H, Jeong J-W, Kang S-K, Kim J-H et al (2015) Biodegradable elastomers and silicon nanomembranes/nanoribbons for stretchable, transient electronics, and biosensors. Nano Lett 15:2801–2808
Hwang SW, Park G, Cheng H, Song JK, Kang SK, Yin L et al (2014) 25th anniversary article: materials for high-performance biodegradable semiconductor devices. Adv Mater 26:1992–2000
Kang S-K, Park G, Kim K, Hwang S-W, Cheng H, Shin J et al (2015) Dissolution chemistry and biocompatibility of silicon-and germanium-based semiconductors for transient electronics. ACS Appl Mater Interfaces 7:9297–9305
Kang S-K, Hwang S-W, Cheng H, Yu S, Kim BH, Kim J-H et al (2014) Dissolution behaviors and applications of silicon oxides and nitrides in transient electronics. Adv Funct Mater 24:4427–4434
Yin L, Farimani AB, Min K, Vishal N, Lam J, Lee YK et al (2015) Mechanisms for hydrolysis of silicon nanomembranes as used in bioresorbable electronics. Adv Mater 27:1857–1864
Fu K, Wang Z, Dai J, Carter M, Hu L (2016) Transient electronics: materials and devices. Chem Mater 28:3527–3539
Cheng H, Vepachedu V (2016) Recent development of transient electronics. Theor Appl Mech Lett 6:21–31
Park CW, Kang SK, Hernandez HL, Kaitz JA, Wie DS, Shin J et al (2015) Thermally triggered degradation of transient electronic devices. Adv Mater 27:3783–3788
Hernandez HL, Kang SK, Lee OP, Hwang SW, Kaitz JA, Inci B et al (2014) Triggered transience of metastable poly (phthalaldehyde) for transient electronics. Adv Mater 26:7637–7642
Hwang SW, Tao H, Kim DH, Cheng H, Song JK, Rill E et al (2012) A physically transient form of silicon electronics. Science 337:1640–1644
Hwang SW, Park G, Edwards C, Corbin EA, Kang SK, Cheng H et al (2014) Dissolution chemistry and biocompatibility of single-crystalline silicon nanomembranes and associated materials for transient electronics. ACS Nano 8:5843–5851
Yin L, Cheng H, Mao S, Haasch R, Liu Y, Xie X et al (2014) Dissolvable metals for transient electronics. Adv Funct Mater 24:645–658
Brenckle MA, Cheng H, Hwang S, Tao H, Paquette M, Kaplan DL et al (2015) Modulated degradation of transient electronic devices through multilayer silk fibroin pockets. ACS Appl Mater Interfaces 7:19870–19875
Hwang SW, Song JK, Huang X, Cheng H, Kang SK, Kim BH et al (2014) High-performance biodegradable/transient electronics on biodegradable polymers. Adv Mater 26:3905–3911
Kim DH, Viventi J, Amsden JJ, Xiao JL, Vigeland L, Kim YS et al (2010) Dissolvable films of silk fibroin for ultrathin conformal bio-integrated electronics. Nat Mater 9:511–517
Jung YH, Chang TH, Zhang H, Yao C, Zheng Q, Yang VW et al (2015) High-performance green flexible electronics based on biodegradable cellulose nanofibril paper. Nat Commun 6:7170
Kim S, Carlson A, Cheng H, Lee S, Park J-K, Huang Y et al (2012) Enhanced adhesion with pedestal-shaped elastomeric stamps for transfer printing. Appl Phys Lett 100:171909
Yang SY, Carlson A, Cheng H, Yu Q, Ahmed N, Wu J et al (2012) Elastomer surfaces with directionally dependent adhesion strength and their use in transfer printing with continuous roll-to-roll applications. Adv Mater 24:2117–2122
Lee EA (2008) Cyber physical systems: design challenges. In: 11th IEEE symposium on object/component/service-oriented real-time distributed computing, ISORC 2008, pp 363–369
Monostori L (2014) Cyber-physical production systems: roots, expectations and R&D challenges. In: 47th CIRP conference on manufacturing systems, pp 9–13
High Confidence Software and Systems Coordinating Group (2009) High-confidence medical devices: cyber-physical systems for 21st century health care. A research and development needs report
Baheti R, Gill H (2010) Cyber-physical systems. In: Samad T, Annaswamy A (eds) The impact of control technology. IEEE Control Systems Society, pp 161–166
Xu S, Yan Z, Jang K-I, Huang W, Fu H, Kim J et al (2015) Assembly of micro/nanomaterials into complex, three-dimensional architectures by compressive buckling. Science 347:154–159
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The authors acknowledge the start-up fund provided by the Engineering Science and Mechanics Department, College of Engineering, and Materials Research Institute at The Pennsylvania State University.
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Ravikumar, V., Yi, N., Vepachedu, V., Cheng, H. (2017). Transfer Printing for Cyber-Manufacturing Systems. In: Jeschke, S., Brecher, C., Song, H., Rawat, D. (eds) Industrial Internet of Things. Springer Series in Wireless Technology. Springer, Cham. https://doi.org/10.1007/978-3-319-42559-7_28
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