Abstract
Temperature-dependent dynamic mechanical properties of epoxy resin were studied by dynamic mechanical analysis. A new temperature-dependent storage modulus model was developed to describe the storage modulus of epoxy resin for multi-transition regions from cryogenics to elevated temperatures. Model predictions showed good agreements with the experimental results.
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Acknowledgments
The authors would like to acknowledge NSFC for financial support (10702036, 11472165) and Shanghai leading Academic Discipline Project (No. S30106). and Shanghai leading Academic Discipline Project (No. S30106).
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Feng, J., Guo, Z. (2017). A New Temperature-Dependent Storage Modulus Model of Epoxy Resin. In: Antoun, B., et al. Challenges in Mechanics of Time Dependent Materials, Volume 2. Conference Proceedings of the Society for Experimental Mechanics Series. Springer, Cham. https://doi.org/10.1007/978-3-319-41543-7_25
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DOI: https://doi.org/10.1007/978-3-319-41543-7_25
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