Abstract
Moulded Interconnect Devices (MID) refer to free form components made of polymer with added electrical (conductors, isolators, etc.) and mechanical functions (carrier module, housing, etc). MID are being used in various industry sectors like telecommunication (antenna), automotive (motorcycle handlebars), medical (hearing aid) and many others, due to the easiness of integration thanks to the geometry freedom. This chapter discusses, in terms of advantages and main challenges, the main MID materials and technologies, such as Two-shot Injection Moulding, Laser Direct Structuring, Hot Embossing, Aerosol-Jet Printing, and presents an overview of their application sectors.
This is a preview of subscription content, log in via an institution to check access.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
Notes
- 1.
A ligand is an ion or molecule attached to a metal atom by coordinate bonding.
References
Franke J, Gausemeier J, Goth C, Dumitrescu R (2011) MID-Studies 2011—Markt- und Technologieanalyse. Eine Studie im Auftrag von Forschungsvereinigung Räumliche Elektronische Baugruppen 3-D MID e-v. (Ed), Erlangen
Franke J (1995) Integrierte Entwicklung neuer Produkt- und Produktiontechnologien für räumliche spritzgegossene Schaltungsträger (3D MID). Hanser, Munich
Osswald TA, Baur E, Brinkmann S (2006) International plastics handbook, 4th edn. Hanser, München
Franke J (2014) Three-dimensional molded interconnect devices (3D-MID). Materials, manufacturing, assembly, and applications for injection molded circuit carriers. Hanser, München
ISO, 1133-1 (2011) Plastics—determination of the melt mass-flow rate (MFR) and melt volume-flow rate (MVR) of thermoplastics. International organization for standardization
3-D MID e.V. Forschungsvereinigung Räumliche Elektronische Baugruppen [Online]. Available http://www.3d-mid.de/2/technology/manufacturing/two-shot-molding/molding-tool.html. 21 Sept 2016
De Zwart RM, Tacken RA, Bolt PJ (2006) Development of a MID LED housing. In: Proceeding of the global conference on micro manufacture, Grenoble
Franke J (2013) Räumliche elektronische Baugruppen (3D-MID), Werkstoffe, Herstellung, Montage und Anwendungen für spritzgegossene Schaltungsträger. Hanser, München
LPKF laser and electronics [Online]. Available http://www.lpkfusa.com/mid/materials.htm 21 Sept 2016
FAPS—Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik [Online]. Available http://www.faps.de 21 Sept 2016
Panasonic [Online]. Available https://www.panasonic.com 21 Sept 2016
Barali L, Ernst C, Elspass S (2006) Lasergestützte MID-Technologien. In: Geiger M et al (eds) Laser in der Elektronikproduktion & Feinwerktechnik—Tagunsband, ninth Erlanger Seminars LEF. Meisenbach, Bamberg
Heininger N, John W, Boßler H-J (2004) Fertigung von MID-Bauteilen vom Rapid Prototyping bis zur Seri emit innovativer LDS-Technologie. Firmenschrifft LPKF Laser & Electronics AG, Garbsen
Hoerber J, Goth C, Franke J (2012) Potential of aerosoljet prining For manufacturing 3-D MID. Innov’Days, PEP, Bellignat
Goth C (2013) Analyse und optimierung der entwicklung und zuverlässigkeit räumlicher schaltungsträger (3D-MID). Meisenbach, Bamberg
Author information
Authors and Affiliations
Corresponding author
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 2017 Springer International Publishing Switzerland
About this chapter
Cite this chapter
Brunet, A., Gengenbach, U., Müller, T., Scholz, S., Dickerhof, M. (2017). Moulded Interconnect Devices. In: Fassi, I., Shipley, D. (eds) Micro-Manufacturing Technologies and Their Applications. Springer Tracts in Mechanical Engineering. Springer, Cham. https://doi.org/10.1007/978-3-319-39651-4_7
Download citation
DOI: https://doi.org/10.1007/978-3-319-39651-4_7
Published:
Publisher Name: Springer, Cham
Print ISBN: 978-3-319-39650-7
Online ISBN: 978-3-319-39651-4
eBook Packages: EngineeringEngineering (R0)