Abstract
In the past decades, the microelectronic industry has been following the Moore’s law to improve the performance of integrated circuits (IC). However, it will probably be impossible to follow this law in the future due to physical limitations appearing with the miniaturization of the transistors below a certain threshold without innovation. In order to overcome this problem, new technologies have emerged, and among them the 3D-Stacked Integrated Circuits (3D-SIC) have been proposed. 3D-SICs can bring numerous advantages in the design of future ICs but at the cost of additional design complexity due to their highly combinatorial nature, and the optimization of several conflicting criteria. Currently, most decisions about the production of a circuit are based on subjective considerations. In order to help designers facing choices when developing 3D chips, we present in this study an application of multi-criteria decision making (MCDM) tools, and more precisely the PROMETHEE methods, to the partitioning problem of 3D-SICs. Our work addresses two different production scenarios for the design of an OpenSPARC-T2 System-on-Chip. With this study, one can observe that multi-criteria analyzes can give to designers insights into the trade-off possibilities for the optimization of a circuit. In addition, the PROMETHEE methodology can help a designer facing choices and provide a transparent process when selecting a valid chip to develop. This shows that applying MCDM tools such as PROMETHEE to design 3D-SICs can indeed help designers to make a better use of this technology.
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OpenSPARC-T2 SoC Design Alternatives: Evaluation Table
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Doan, N.A.V., Milojevic, D., De Smet, Y. (2017). MCDM Applied to the Partitioning Problem of 3D-Stacked Integrated Circuits. In: Zopounidis, C., Doumpos, M. (eds) Multiple Criteria Decision Making. Multiple Criteria Decision Making. Springer, Cham. https://doi.org/10.1007/978-3-319-39292-9_9
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DOI: https://doi.org/10.1007/978-3-319-39292-9_9
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