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Hierarchical Power Distribution Networks

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On-Chip Power Delivery and Management

Abstract

Supplying power to high performance integrated circuits has become a challenging task. The system supplying power to an integrated circuit greatly affects the performance, size, and cost characteristics of the overall electronic system.

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Notes

  1. 1.

    The magnetic coupling of the power and ground conductors is omitted in the circuit diagrams of a power distribution system. The inductive elements shown in the diagrams therefore denote a net inductance, as described in Sect. 2.1.4

  2. 2.

    The circuit impedance drastically increases near the resonant frequency in parallel (tank) resonant circuits. The parallel resonance is therefore often referred to as the antiresonance to distinguish this phenomenon from the series resonance, where the circuit impedance decreases. Correspondingly, peaks in the impedance are often referred to as antiresonant.

  3. 3.

    Equation (7.40) neglects the internal inductance of the metal planes, i.e., the inductance associated with the magnetic flux within the planes. Omission of the internal inductance is a good approximation where the thickness of the planes is much smaller than the separation between the planes and at high signal frequencies, where current flow is restricted to the surface of the planes due to a pronounced skin (proximity) effect.

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P.-Vaisband, I., Jakushokas, R., Popovich, M., Mezhiba, A.V., Köse, S., Friedman, E.G. (2016). Hierarchical Power Distribution Networks. In: On-Chip Power Delivery and Management. Springer, Cham. https://doi.org/10.1007/978-3-319-29395-0_7

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  • DOI: https://doi.org/10.1007/978-3-319-29395-0_7

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