Skip to main content

Scaling Trends of On-Chip Power Noise

  • Chapter
  • First Online:
On-Chip Power Delivery and Management

Abstract

A scaling analysis of the voltage drop across the on-chip power distribution networks is performed in this chapter. The design of power distribution networks in high performance integrated circuits has become significantly more challenging with recent advances in process technology.

This is a preview of subscription content, log in via an institution to check access.

Access this chapter

Chapter
USD 29.95
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
eBook
USD 139.00
Price excludes VAT (USA)
  • Available as EPUB and PDF
  • Read on any device
  • Instant download
  • Own it forever
Softcover Book
USD 179.99
Price excludes VAT (USA)
  • Compact, lightweight edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info
Hardcover Book
USD 249.99
Price excludes VAT (USA)
  • Durable hardcover edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info

Tax calculation will be finalised at checkout

Purchases are for personal use only

Institutional subscriptions

References

  1. A.V. Mezhiba, E.G. Friedman, Power Distribution Networks in High Speed Integrated Circuits (Kluwer Academic, Norwell, 2004)

    Book  Google Scholar 

  2. I.S. Kourtev, E.G. Friedman, Timing Optimization Through Clock Skew Scheduling (Kluwer Academic, Norwell, 2000)

    Book  MATH  Google Scholar 

  3. Y.I. Ismail, E.G. Friedman, On-Chip Inductance in High Speed Integrated Circuits (Kluwer Academic, Norwell, 2001)

    Book  MATH  Google Scholar 

  4. A.V. Mezhiba, E.G. Friedman, Properties of on-chip inductive current loops, in Proceedings of the ACM Great Lakes Symposium on Very Large Scale Integration, pp. 12–17, Apr 2002

    Google Scholar 

  5. A.V. Mezhiba E.G. Friedman, Inductive characteristics of power distribution grids in high speed integrated circuits, in Proceedings of the IEEE International Symposium on Quality Electronic Design, pp. 316–321, Mar 2002

    Google Scholar 

  6. A.V. Mezhiba, E.G. Friedman, Inductive properties of high-performance power distribution grids. IEEE Trans. Very Large Scale Integr. (VLSI) Circuits 10(6), 762–776 (2002)

    Google Scholar 

  7. International Technology Roadmap for Semiconductors, 2006 Update (Semiconductor Industry Association, 2006). http://public.itrs.net

  8. R.H. Dennard, F.H. Gaensslen, V.L. Rideout, E. Bassous, A.R. LeBlanc, Design of ion-implanted MOSFET’s with very small physical dimensions. IEEE J. Solid-State Circuits SC–33(5), 256–268 (1974)

    Google Scholar 

  9. K.C. Saraswat, E. Mohammadi, Effect of scaling of interconnections on the time delay of VLSI circuits. IEEE Trans. Electron Devices ED–29(4), 645–650 (1982)

    Google Scholar 

  10. H.B. Bakoglu, Circuit, Interconnections and Packaging for VLSI (Addison Wesley, Reading, 1990)

    Google Scholar 

  11. L.A. Arledge Jr., W.T. Lynch, Scaling and performance implications for power supply and other signal routing constraints imposed by I/O limitations, in Proceedings of the IEEE Symposium on IC/Package Design Integration, pp. 45–50, Feb 1998

    Google Scholar 

  12. W.S. Song, L.A. Glasser, Power distribution techniques for VLSI circuits. IEEE J. Solid-State Circuits SC–21(1), 150–156, (1986)

    Google Scholar 

  13. P. Larsson, Noise in CMOS integrated circuits didt. Analog Integr. Circuits Signal Process. 14(1/2), 113–129 (1997)

    Google Scholar 

  14. B.D. McCredie, W.D. Becker, Modeling, measurement, and simulation of simultaneous switching noise. IEEE Trans. Compon. Packag. Manuf. Technol. Pt. B: Adv. Packag. 19(3), 461–472 (1996)

    Article  Google Scholar 

  15. S.R. Nassif, O. Fakhouri, Technology trends in power-grid-induced noise, in Proceedings of the Workshop on System Level Interconnect Prediction, pp. 55–59, Apr 2002

    Google Scholar 

  16. International Technology Roadmap for Semiconductors, 1999 edn. (Semiconductor Industry Association, 1999). http://public.itrs.net

  17. International Technology Roadmap for Semiconductors, 1997 edn. (Semiconductor Industry Association, 1997). http://public.itrs.net

  18. International Technology Roadmap for Semiconductors, 1998 Update (Semiconductor Industry Association, 1998). http://public.itrs.net

  19. International Technology Roadmap for Semiconductors, 2001 edn. (Semiconductor Industry Association, 2001). http://public.itrs.net

  20. A.V. Mezhiba, E.G. Friedman, Inductance/area/resistance tradeoffs in high performance power distribution grids, in Proceedings of the IEEE International Symposium on Circuit and Systems, vol. I, pp. 101–104, May 2002

    Google Scholar 

  21. R.R. Tummala, E.J. Rymaszewski, A.G. Klopfenstein (eds.), Microelectronics Packaging Handbook (Chapman & Hall, New York, 1997)

    Google Scholar 

  22. D. Sylvester, H. Kaul, Future performance challenges in nanometer design, in Proceedings of the IEEE/ACM Design Automation Conference, pp. 3–8, June 2001

    Google Scholar 

  23. A.V. Mezhiba, E.G. Friedman, Scaling trends of on-chip power distribution noise, in Proceedings of the Workshop on System Level Interconnect Prediction, pp. 47–53, Apr 2002

    Google Scholar 

  24. R. Jakushokas, E.G. Friedman, Line width optimization for interdigitated power/ground networks, in Proceedings of the ACM Great Lakes Symposium on Very Large Scale Integration, pp. 329–334, May 2010

    Google Scholar 

  25. A.V. Mezhiba, E.G. Friedman, Electrical characteristics of multi-layer power distribution grids, in Proceedings of the IEEE International Symposium on Circuit and Systems, vol. 5, pp. 473–476, May 2003

    Google Scholar 

  26. A. Deutsch et al., The importance of inductance and inductive coupling for on-chip wiring, in IEEE Topical Meeting on Electrical Performance of Electronic Packaging, pp. 53–56, Oct 1997

    Google Scholar 

Download references

Author information

Authors and Affiliations

Authors

Rights and permissions

Reprints and permissions

Copyright information

© 2016 Springer International Publishing Switzerland

About this chapter

Cite this chapter

P.-Vaisband, I., Jakushokas, R., Popovich, M., Mezhiba, A.V., Köse, S., Friedman, E.G. (2016). Scaling Trends of On-Chip Power Noise. In: On-Chip Power Delivery and Management. Springer, Cham. https://doi.org/10.1007/978-3-319-29395-0_5

Download citation

  • DOI: https://doi.org/10.1007/978-3-319-29395-0_5

  • Published:

  • Publisher Name: Springer, Cham

  • Print ISBN: 978-3-319-29393-6

  • Online ISBN: 978-3-319-29395-0

  • eBook Packages: EngineeringEngineering (R0)

Publish with us

Policies and ethics