Abstract
On-chip power integration is necessary for delivering high quality power to modern high performance circuits. The tradeoff between power efficiency and area for switching and linear power supplies is discussed in Chap. 16 To optimize the power efficiency of a system with existing power supplies, the power should be primarily converted with a few power efficient switching supplies, delivered to on-chip voltage clusters, and regulated with linear low dropout regulators within the individual power domains. This principle with multiple voltage clusters is illustrated in Fig. 26.1 by a heterogeneous power delivery system with multiple power domains, off-chip/in-package/on-chip SMPS power converters, and on-chip LDO power regulators.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
References
S. Kose, E.G. Friedman, Distributed on-chip power delivery. IEEE J. Emerg. Sel. Top. Circuits Syst. 2(4), 704–713 (2012)
S.R. Nassif, Power grid analysis benchmarks, in Proceedings of the IEEE/ACM Asia and South Pacific Design Automation Conference, pp. 376–381, Jan 2008
S. Kose, S. Tam, S. Pinzon, B. McDermott, E.G. Friedman, Active filter based hybrid on-chip DC-DC converters for point-of-load voltage regulation. IEEE Trans. Very Large Scale Integr. (VLSI) Circuits 21(4), 680–691 (2013)
Y. Okuma, K. Ishida, Y. Ryu, X. Zhang, P.-H. Chen, K. Watanabe, M. Takamiya, T. Sakurai, 0.5-V input digital LDO with 98.7% current efficiency and 2.7-μA quiescent current in 65nm CMOS, in Proceedings of the IEEE Custom Integrated Circuits Conference, pp. 1–4, Sept 2010
J. Gjanci, M.H. Chowdhury, A hybrid scheme for on-chip voltage regulation in system-on-a-chip (SOC). IEEE Trans. Very Large Scale Integr. (VLSI) Circuits 19(11), 1949–1959 (2011)
Y.-H. Lam, W.-H. Ki, A 0.9 V 0.35 μm adaptively biased CMOS LDO regulator with fast transient response, in Proceedings of the IEEE International Solid-State Circuits Conference, pp. 442–626, Feb 2008
M. Ho, K.N. Leung, K.-L. Mac, A low-power fast-transient 90-nm low-dropout regulator with multiple small-gain stages. IEEE J. Solid-State Circuits 45(11), 2466–2475 (2010)
Z. Zeng, X. Ye, Z. Feng, P. Li, Tradeoff analysis and optimization of power delivery networks with on-chip voltage regulation, in Proceedings of the IEEE/ACM Design Automation Conference, pp. 831–836, June 2010
M.K. Tavana, M.H. Hajkazemi, D. Pathak, I. Savidis, H. Homayoun, ElasticCore: enabling dynamic heterogeneity with joint core and voltage/frequency scaling, in Proceedings of the IEEE/ACM Design Automation Conference, pp. 1–6, June 2015
B. Amelifard, M. Pedram, Optimal design of the power-delivery network for multiple voltage-island system-on-chips. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 28(6), 888–900 (2009)
I. Vaisband E.G. Friedman, Energy efficient adaptive clustering of on-chip power delivery systems. Integr. VLSI J. 48, 1–9 (2015)
I. Vaisband, E.G. Friedman, Computationally efficient clustering of power supplies in heterogeneous real time systems, in Proceedings of the IEEE International Symposium on Circuit and Systems, pp. 1628–1631, June 2014
Y. Kim, P. Li, An ultra-low voltage digitally controlled low-dropout regulator with digital background calibration, in Proceedings of the IEEE International Symposium on Quality Electronic Design, pp. 151–158, Mar 2012
Y. Xiong, S. Sun, H. Jia, P. Shea, Z.J. Shen, New physical insights on power MOSFET switching losses. IEEE Trans. Power Electron. 24(2), 525–531 (2009)
C.P. Robert, G. Casella, Monte Carlo Statistical Methods (Springer, New York, 1999)
Author information
Authors and Affiliations
Rights and permissions
Copyright information
© 2016 Springer International Publishing Switzerland
About this chapter
Cite this chapter
P.-Vaisband, I., Jakushokas, R., Popovich, M., Mezhiba, A.V., Köse, S., Friedman, E.G. (2016). Power Supply Clustering in Heterogeneous Systems. In: On-Chip Power Delivery and Management. Springer, Cham. https://doi.org/10.1007/978-3-319-29395-0_26
Download citation
DOI: https://doi.org/10.1007/978-3-319-29395-0_26
Published:
Publisher Name: Springer, Cham
Print ISBN: 978-3-319-29393-6
Online ISBN: 978-3-319-29395-0
eBook Packages: EngineeringEngineering (R0)