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Discrete Photodiodes

  • Mohamed AtefEmail author
  • Horst Zimmermann
Chapter
Part of the Springer Series in Advanced Microelectronics book series (MICROELECTR., volume 55)

Abstract

Low production costs are important for large volume production. For POF communications large-area PDs are needed which will increase the chip costs if integrated in the same expensive nanometer CMOS technology.

Keywords

Dark Current Solder Bump Bond Wire Molten Solder Optical Receiver 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Springer International Publishing Switzerland 2016

Authors and Affiliations

  1. 1.Faculty of EngineeringAssiut UniversityAssiutEgypt
  2. 2.Institute of Electrodynamics, Microwave and Circuit EngineeringTU WienViennaAustria

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