Discrete Photodiodes

  • Mohamed AtefEmail author
  • Horst Zimmermann
Part of the Springer Series in Advanced Microelectronics book series (MICROELECTR., volume 55)


Low production costs are important for large volume production. For POF communications large-area PDs are needed which will increase the chip costs if integrated in the same expensive nanometer CMOS technology.


Dark Current Solder Bump Bond Wire Molten Solder Optical Receiver 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.


  1. 1.
    A. Marchlewski, W. Gaberl, H. Zimmermann, A SiGe Optical Receiver with Large-area Photodiode, in Proceedings of SPIE, Optical Sensing Technology and Applications, vol. 6585 (2007), pp. 65851Q1–Q9Google Scholar
  2. 2.
    M. Atef, H. Zimmermann, Optical Communication over Plastic Optical Fibers: Integrated Optical Receiver Technology (Springer, Berlin, 2013)Google Scholar
  3. 3.
  4. 4.
    A. Marchlewski, H. Zimmermann, I. Jonak-Auer, G. Meinhardt, E. Wachmann, Improvement of universal PIN Photodetectors in 0.35 \(\upmu \) m SiGe BiCMOS technology. Electron. Lett. 45(13), 705–706 (2009)CrossRefGoogle Scholar
  5. 5.
  6. 6.
    H. Zimmermann, Integrated Silicon Optoelectronics, 2nd edn. (Springer, Berlin, 2010)Google Scholar
  7. 7.
    L. Vivien, A. Polzer, D. Marris-Morini, J. Osmond, J.M. Hartmann, P. Crozat, E. Cassan, C. Kopp, H. Zimmermann, J.M. Fdli, Zero-bias 40 Gbit/s germanium waveguide photodetector on silicon. Opt. Express 20(2), 1096–1101 (2012)ADSCrossRefGoogle Scholar
  8. 8.
    L. Vivien, J. Osmond, J.-M. Fdli, D. Marris-Morini, P. Crozat, J.-F. Damlencourt, E. Cassan, Y. Lecunff, S. Laval, 42 GHz p.i.n germanium photodetector integrated in a silicon-on-insulator waveguide. Opt. Express 17(8), 6252–6257 (2009)ADSCrossRefGoogle Scholar
  9. 9.
    G.P. Agrawal, Fiber-Optic Communication Systems, 3rd edn. (Wiley, NewYork, 2002)Google Scholar
  10. 10.
    K. Katsura, T. Hayashi, F. Ohira, S. Hata, K. Iwashita, A novel flip-chip interconnection technique using solder bumps for high-speed photoreceivers. IEEE J. Lightwave Technol. 8(9), 1323 (1990)Google Scholar
  11. 11.
    A.V. Krishnamoorthy, D.A.B. Miller, Scaling optoelectronic-VLSI circuits into the 21st century: a technology roadmap. IEEE J. Sel. Top. Quantum Electron. 2(1), 55 (1996)Google Scholar

Copyright information

© Springer International Publishing Switzerland 2016

Authors and Affiliations

  1. 1.Faculty of EngineeringAssiut UniversityAssiutEgypt
  2. 2.Institute of Electrodynamics, Microwave and Circuit EngineeringTU WienViennaAustria

Personalised recommendations