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Technological Cycle and S-Curve: A Nonconventional Trend in the Microprocessor Market

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Organizational Innovation and Change

Part of the book series: Lecture Notes in Information Systems and Organisation ((LNISO,volume 13))

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Abstract

In the literature there is agreement on the fact that battles between two technologies sooner or later end with the dominance of one over the others, or, under certain conditions, with their coexistence. The aim of this paper is to understand if competition between rival technologies can be reopened after one technology dominates the market. We argue that, if a technology has prevailed this could not be a static situation, but rather a dynamic one. In doing so, we have analyzed the microprocessor market, finding a nonconventional S-curve trend.

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Notes

  1. 1.

    Source PC Magazine.

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Acknowledgement

Fabiana Marras gratefully acknowledges Sardinia Regional Government for the financial support of her PhD scholarship (P.O.R. Sardegna F.S.E. Operational Programme of the Autonomous Region of Sardinia, European Social Fund 2007–2013—Axis IV Human Resources, Objective l.3, Line of Activity l.3.1.).

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Authors and Affiliations

  1. University of Cagliari, Cagliari, Italy

    G. Ennas, F. Marras & M. C. Di Guardo

Authors
  1. G. Ennas
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  2. F. Marras
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  3. M. C. Di Guardo
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Corresponding author

Correspondence to G. Ennas .

Editor information

Editors and Affiliations

  1. Department of Business Administration, University of Verona, Verona, Italy

    Cecilia Rossignoli

  2. Department of Management, University of Rome "La Sapienza", Rome, Italy

    Mauro Gatti

  3. Department of Management, Accounting and Economics, University of Naples "Parthenope", Naples, Italy

    Rocco Agrifoglio

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Ennas, G., Marras, F., Di Guardo, M.C. (2016). Technological Cycle and S-Curve: A Nonconventional Trend in the Microprocessor Market. In: Rossignoli, C., Gatti, M., Agrifoglio, R. (eds) Organizational Innovation and Change. Lecture Notes in Information Systems and Organisation, vol 13. Springer, Cham. https://doi.org/10.1007/978-3-319-22921-8_7

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