Abstract
This paper discusses Double Cantilever Beam (DCB) test methods that were developed for characterizing adhesion strength of several critical interfaces in advanced microelectronic packaging. Those interfaces include silicon-epoxy underfill and solder resist-epoxy underfill. A unique sample preparation technique was developed for DCB testing of each interface in order to avoid the testing challenges specific to that interface—for example, silicon cracking and voiding in silicon-underfill samples and cracking of solder resist films in solder resist-underfill samples. Additionally, asymmetric DCB samples (i.e., different cantilever beam thickness on top compared to the bottom) were found to be more effective in maintaining the crack at the interface of interest and in reducing the occurrence of cohesive cracking when compared to symmetric DCB samples. Several case studies using DCB for material selection and assembly process optimization are also discussed. Furthermore, fractography results from SEM examination of the fractured surfaces are also presented for better understanding of the failure mode.
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R. Lacombe, Adhesion measurement methods: theory and practice (CRC, Boca Raton, 2006)
R. Pearson, Adhesion fundamentals for microelectronic packaging. in IMAPS Device Packaging 2014 Professional Development Course (Fountain Hills, AZ, 2014)
L.F.M. da Silva, D.A. Dillard, B.R.K. Blackman, R.D. Adams, Testing adhesive joints (Wiley-VCH, Weinhem, 2012)
J.W. Hutchinson, Z. Suo, Mixed mode cracking in layered materials. Adv. Appl. Mech. 29, 63–191 (1991)
X. Dai, M.V. Brillhar, P.S. Ho, Adhesion measurement for electronic packaging applications using double cantilever beam method. IEEE Trans. Comp. Packag. Technol. 23(1), 101–116 (2000)
M.F. Kanninen, Augmented double cantilever beam model for studying crack-propagation and arrest. Int. J. Fract. 9, 83–92 (1973)
G. Bao, S. Ho, Z. Suo, B. Fan, The role of material orthotropy in fracture specimens of composites. Int. J. Solids Struct. 29(9), 1105–1116 (1992)
Acknowledgments
The authors would like to acknowledge the outstanding contributions from the following persons, all from Intel® Corporation: Liwei Wang, Nachiket Raravikar, Deepak Arora, Joe Bautista, Arjun Krishnan, Nisha Ananthakrishnan, Akshay Mathkar, Frank Prieto, Dave McCoy, Don Erickson, Alan Overson, Bob Dalpe, Rodney Wells, Patrick Nardi, Beverly Canham, Dilan Seneviratne, Bharat Penmecha, Edvin Cetegen, and Jon Atkins.
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© 2016 The Society for Experimental Mechanics, Inc.
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Alazar, T., Sankarasubramanian, S., Yagnamurthy, S., Yazzie, K., Liu, P., Malatkar, P. (2016). Symmetric and Asymmetric Double Cantilever Beam Methods for Interfacial Adhesion Strength Measurement in Electronic Packaging. In: Sciammarella, C., Considine, J., Gloeckner, P. (eds) Experimental and Applied Mechanics, Volume 4. Conference Proceedings of the Society for Experimental Mechanics Series. Springer, Cham. https://doi.org/10.1007/978-3-319-22449-7_19
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DOI: https://doi.org/10.1007/978-3-319-22449-7_19
Publisher Name: Springer, Cham
Print ISBN: 978-3-319-22448-0
Online ISBN: 978-3-319-22449-7
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