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Analyzing the Trade-off Between Different Memory Cores and Controllers

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IP Cores Design from Specifications to Production

Part of the book series: Analog Circuits and Signal Processing ((ACSP))

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Abstract

With the move to multicore computing, the demand for memory bandwidth grows with the number of cores. It is predicted that multicore computers will need 1 TBps of memory bandwidth. However, memory device scaling is facing increasing challenges due to the limited number of read and write cycles in flash memories and capacitor-scaling limitations for DRAM cells. Therefore, memory bottleneck is one of the main challenges in modern VLSI design. Microprocessors communicate with memory cores through memory controllers (Fig. 3.1). A detailed figure is shown in Fig. 3.2 [1–6].

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References

  1. Akesson B, Huang P, Clermidy F, Dutoit D (2011) Memory controllers for high-performance and real-time MPSoCs. In: Proceedings of the seventh IEEE/ACM/IFIP international conference on Hardware/software codesign and system synthesis, ACM, New York

    Google Scholar 

  2. Clermidy F, Darve F, Dutoit D (2011) 3D Embedded multi-core: some perspectives. In: Design, Automation & Test in Europe Conference & Exhibition (DATE), IEEE, Grenoble

    Google Scholar 

  3. Weis C, Wehn N, Igor L, Benini L (2011) Design space exploration for 3D-stacked DRAMs. In: Design, Automation & Test in Europe Conference & Exhibition (DATE), IEEE, Grenoble, pp 1–6

    Google Scholar 

  4. Min S, Nam E (2006) Current trends in flash memory technology. In: Asia and South Pacific Conference on Design Automation (ASPDAC), IEEE, Yokohama

    Google Scholar 

  5. Loi L, Benini L (2010) An efficient distributed memory interface for many-core platform with 3D stacked DRAM. In: Proceedings of Design, Automation Test in Europe Conference Exhibition (DATE), Germany, pp 99-104

    Google Scholar 

  6. Zhang T, Wang K, Feng Y, Song X (2010) A customized design of DRAM controller for on-chip 3D DRAM stacking. In: IEEE Custom Integrated Circuits Conference (CICC), San Jose

    Google Scholar 

  7. Jacob B (2008) Memory systems cache, DRAM, disk. Morgan Kaufmann, Burlington

    Google Scholar 

  8. http://www.micron.com/~/media/Documents/Products/Presentation/WinHEC_Cooke.pdf

  9. Zhang Y, Swanson S (2015) A study of application performance with non-volatile main memory. In: Proceedings of the 31st IEEE Conference on Massive Data Storage, IEEE

    Google Scholar 

  10. http://download.microsoft.com/download/d/f/6/df6accd5-4bf2-4984-8285-f4f23b7b1f37/winhec2007_micron_nand_flashmemory.doc

  11. Pasricha S, Dutt N (2008) On-chip communication architectures: system on chip interconnects. Morgan Kaufmann, Burlington

    Google Scholar 

  12. https://www.jedec.org/

  13. http://www.jedec.org/sites/default/files/docs/JESD84-B42.pdf

  14. http://www.datasheetcatalog.org/datasheets2/12/1248447_1.pdf

  15. http://www.jedec.org/standards-documents/docs/jesd-79-3d

  16. Hybrid memory cube (2013) Technical Report Revision 1.0, HMC. www.hybridmemorycube.org. Accessed January 2013

  17. Wide I/O single data rate, Technical Report Revision 1.0, Wide IO. Accessed December 2011

    Google Scholar 

  18. www.onfi.org

  19. http://www.jedec.org/standards-documents/focus/flash/universal-flash-storage-ufs

  20. https://www.jedec.org/standards-documents/docs/jesd235

  21. Xie Y (2014) Emerging memory technologies. Springer, New York

    Book  Google Scholar 

  22. Kavehei O, Iqbal A, Kim YS, Eshraghian K, AL-Sarawi SF, Abbott D (2010) The fourth element: characteristics, modelling, and electromagnetic theory of the memristor. Proc Roy Soc A Math Phys Eng Sci 466:2175–2202

    Article  MathSciNet  MATH  Google Scholar 

  23. Lacaze P-C, Lacroix J-C (2014) Non-volatile memories. Wiley, Hoboken

    Book  Google Scholar 

  24. Kim C, Lee H-W, Song J (2014) High-bandwidth memory interface. Springer, New York

    Book  Google Scholar 

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Mohamed, K.S. (2016). Analyzing the Trade-off Between Different Memory Cores and Controllers. In: IP Cores Design from Specifications to Production. Analog Circuits and Signal Processing. Springer, Cham. https://doi.org/10.1007/978-3-319-22035-2_3

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  • DOI: https://doi.org/10.1007/978-3-319-22035-2_3

  • Publisher Name: Springer, Cham

  • Print ISBN: 978-3-319-22034-5

  • Online ISBN: 978-3-319-22035-2

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