Abstract
The concept of “ambient electronics”, referring to electronics embedded extensively in common environments, has emerged in recent years. Embedding intelligence in surfaces such as walls, ceilings, clothes and packages will improve safety, security and convenience in everyday life [1]. We will refer to these novel applications as “smart systems-on-foil”. Such systems require characteristics that are not met by silicon-based technologies, for example mechanical flexibility and large-area integration at a low cost. The standard crystalline and amorphous silicon technologies require high processing temperatures which are incompatible with flexible surfaces [2]. The possible alternative solutions, such as the thin chip technology [3] and substrate transfer from silicon-on-insulator wafers [4], currently require a fabrication procedure that is not suitable to large-area applications, is complex and, hence, costly. Therefore, there is a growing need for technologies to build electronics with different characteristics from what mainstream silicon technology provides.
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Notes
- 1.
A thin film of silicon is built on a layer of oxide lying on a thick silicon substrate, later removed by subtracting methods.
- 2.
The material in solution is used as “ink” in an inkjet printer to form droplets using techniques such as thermal or piezoelectric drop-on-demand (DOD) [49].
- 3.
The ink is pushed through a screen comprising a fine mesh. The pattern is defined by filling certain openings of the mesh with a stencil material [51].
- 4.
In this work, the term “unipolar” is used for technologies incorporating only one type of transistor (p- or n-type).
- 5.
Zero-gate-source voltage. This kind of load is used only for technologies which provide normally-on (or depletion) transistors.
- 6.
A type of reader-talks-first protocol, patented by Friendly Technologies Ltd., in which the RFID tag only sends a reply to the reader when it receives its unique identity code.
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Abdinia, S., van Roermund, A.H.M., Cantatore, E. (2015). Introduction. In: Design of Organic Complementary Circuits and Systems on Foil. Analog Circuits and Signal Processing. Springer, Cham. https://doi.org/10.1007/978-3-319-21188-6_1
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DOI: https://doi.org/10.1007/978-3-319-21188-6_1
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