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3D Stacked Chips pp 29–67Cite as

Energy Efficient Electrical Intra-Chip-Stack Communication

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Abstract

Through-silicon via (TSV) based 3D chip stacks provide many resources for compact and fast inter chip communication within a chip stack. They allow the design of highly integrated, heterogeneous, and compact systems with reduced overall power consumption, but very limited heat dissipation capability. This chapter presents a holistic packet-in packet-out point-to-point link architecture suitable for constructing a 3D network-on-chip (NoC) for connecting several processing elements within a Globally Asynchronous Locally Synchronous (GALS) design in a chip stack. This architecture has been implemented for long distance on-chip communication and for intra-chip-stack TSV based communication. After presenting a TSV behavioral description, models, hardware results, and a method for equivalent circuit parameter extraction, an energy efficient, capacitive coupling TSV transceiver is presented.

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Authors and Affiliations

  1. Technische Universität Dresden, Chair of Highly-Parallel VLSI-Systems and Neuro-Microelectronics, Dresden, Germany

    Johannes Görner, Dennis Walter & Sebastian Höppner

  2. Technische Universität Dresden, Chair for RF Engineering, Dresden, Germany

    Michael Haas

Authors
  1. Johannes Görner
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  2. Dennis Walter
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  3. Michael Haas
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  4. Sebastian Höppner
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Corresponding author

Correspondence to Johannes Görner .

Editor information

Editors and Affiliations

  1. Masdar Institute of Science & Techn, Abu Dhabi, United Arab Emirates

    Ibrahim (Abe) M. Elfadel

  2. Vodafone Chair Mobile Communication, Dresden, Germany

    Gerhard Fettweis

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Görner, J., Walter, D., Haas, M., Höppner, S. (2016). Energy Efficient Electrical Intra-Chip-Stack Communication. In: Elfadel, I., Fettweis, G. (eds) 3D Stacked Chips. Springer, Cham. https://doi.org/10.1007/978-3-319-20481-9_3

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  • DOI: https://doi.org/10.1007/978-3-319-20481-9_3

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  • Publisher Name: Springer, Cham

  • Print ISBN: 978-3-319-20480-2

  • Online ISBN: 978-3-319-20481-9

  • eBook Packages: EngineeringEngineering (R0)

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