Abstract
A 3D-IC system consists of disparate materials with considerably different thermal properties including semiconductor, metal, dielectric, and possibly polymer layers used for inter-plane bonding. Although the power consumption of these circuits is expected to decrease due to the considerably shorter interconnects, the power density increases since there is a greater number of devices per unit volume as compared to a 2D circuit. Heat transfer analysis in 3D-ICs is complicated by the presence of multiple heat sources and the introduction of new thermal resistances posed by inter-die materials including interface resistances whose values are not readily available. In this chapter we present a fast and accurate 3D thermal model developed for an n-tier 3D stacked Tree-based FPGA chip using 3D R-C mesh-based model. The design and implementation of 3D thermal analysis model depends on the characteristics materials and layers used to manufacture VLSI chips.
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Pangracious, V., Marrakchi, Z., Mehrez, H. (2015). Three-Dimensional Thermal Modeling: Tools and Methodologies. In: Three-Dimensional Design Methodologies for Tree-based FPGA Architecture. Lecture Notes in Electrical Engineering, vol 350. Springer, Cham. https://doi.org/10.1007/978-3-319-19174-4_7
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DOI: https://doi.org/10.1007/978-3-319-19174-4_7
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