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mm-Wave Broadband Power Amplifier Towards 20+dBm

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Part of the book series: Analog Circuits and Signal Processing ((ACSP))

Abstract

As discussed in Chap. 1, there is a growing trend of utilizing E-band technology in future mobile network infrastructure, such as small cell or mobile backhauls [1, 2]. It can also be deployed as a low-cost infrastructure complement to fiber. Chapter 6 has shown the feasibility of achieving more than 10 Gb/s data rate with proven silicon in CMOS. To extend the link distance beyond several kilometers, more than 20 dBm output power has to be delivered by the PA. It is obviously not an easy task for CMOS PAs due to the low breakdown voltage and high operating frequencies [3, 4].

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Notes

  1. 1.

    The designs in [7, 8] have estimated core areas of 2 and 4.7 mm2, respectively, according to the presented die micrographs.

  2. 2.

    The operating power gain is defined as the ratio of the power delivered from the network to the load and the power fed to the network.

  3. 3.

    The insertion loss of a power divider refers to the extra passive loss in addition to the theoretical loss due to the power splitting (i.e., 3 dB for a 2-way power divider).

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Zhao, D., Reynaert, P. (2015). mm-Wave Broadband Power Amplifier Towards 20+dBm. In: CMOS 60-GHz and E-band Power Amplifiers and Transmitters. Analog Circuits and Signal Processing. Springer, Cham. https://doi.org/10.1007/978-3-319-18839-3_7

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  • DOI: https://doi.org/10.1007/978-3-319-18839-3_7

  • Publisher Name: Springer, Cham

  • Print ISBN: 978-3-319-18838-6

  • Online ISBN: 978-3-319-18839-3

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