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Three-Dimensional Integration of Semiconductors pp 1–23Cite as

Research and Development History of Three-Dimensional Integration Technology

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The first chapter of the book introduces research and development history of three-dimensional (3D) integration technology. Concept of through-Si via (TSV) is old but the industrialization of 3D integration technology was leaded by 3D packaging technology first. 3D integration technology development using TSV have been conducted word wide since around 2000. This chapter describes the 3D technology development history from the beginning through 2012.

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Authors and Affiliations

  1. Osaka Prefecture University, Osaka, Japan

    Morihiro Kada

  2. The National Institution of Advanced Industrial Science and Technology (AIST), Ibaraki, Japan

    Morihiro Kada

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  1. Morihiro Kada
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Correspondence to Morihiro Kada .

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Editors and Affiliations

  1. Department of Chemical Engineering, Osaka Prefecture University, Osaka, Japan

    Kazuo Kondo

  2. AIST , Tsukuba, Ibaraki, Japan

    Morihiro Kada

  3. Toshiba Corporation, Oita, Japan

    Kenji Takahashi

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Kada, M. (2015). Research and Development History of Three-Dimensional Integration Technology. In: Kondo, K., Kada, M., Takahashi, K. (eds) Three-Dimensional Integration of Semiconductors. Springer, Cham. https://doi.org/10.1007/978-3-319-18675-7_1

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