Abstract
Kinetics of dispergation-coagulation processes of various metal (Ag, Au, Cu, Nb, Hf) nanofilms of 100 nm thickness, which are deposited onto oxide and nonoxide substrates and are annealing in a wide range of temperatures from 600 up to 1,600 °C, is investigated. The explanation of metal nanofilm decomposition mechanism with regard to the processes occurring in film–solid base interphase boundary is proposed.
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Naidich, Y.V., Gab, I.I., Stetsyuk, T.V., Kostyuk, B.D. (2015). Kinetics of Dispersion-Coagulation During Annealing of Metal Nanofilms Deposited onto the Surface of Non-metallic Materials. In: Fesenko, O., Yatsenko, L. (eds) Nanoplasmonics, Nano-Optics, Nanocomposites, and Surface Studies. Springer Proceedings in Physics, vol 167. Springer, Cham. https://doi.org/10.1007/978-3-319-18543-9_3
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DOI: https://doi.org/10.1007/978-3-319-18543-9_3
Publisher Name: Springer, Cham
Print ISBN: 978-3-319-18542-2
Online ISBN: 978-3-319-18543-9
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