Abstract
In recent years, the LED backlight module has become the main development of the thin film transistor liquid crystal display (TFT-LCD) module. The light guide plate warpage is the major source of ripple phenomenon found in the TFT-LCD module. In this chapter, different molding technological parameters are used for the experiment by the Taguchi method in the manufacturing process to find the factors of light guide plate warpage. The results of this manufacturing process are used to identify the optimization for production processes.
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Acknowledgments
This work was supported by the Ministry of Science and Technology of Taiwan, Republic of China, under Grant number MOST 103-2221-E-035-039.
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Cheng, PJ., Cheng, CH. (2016). Application of the Taguchi Method to the Warpage for Light Guide Plate. In: Juang, J. (eds) Proceedings of the 3rd International Conference on Intelligent Technologies and Engineering Systems (ICITES2014). Lecture Notes in Electrical Engineering, vol 345. Springer, Cham. https://doi.org/10.1007/978-3-319-17314-6_3
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DOI: https://doi.org/10.1007/978-3-319-17314-6_3
Publisher Name: Springer, Cham
Print ISBN: 978-3-319-17313-9
Online ISBN: 978-3-319-17314-6
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