Abstract
One aspect that is important for QCA circuits in specific technologies is thermal robustness. For example, the performance of a metal-dot QCA circuit is subject to thermal fluctuation [1]. In particular, one has to take care of polarization, since in large designs this could be as important as delay or area. In this chapter, we present brief studies and comparisons of adder designs with respect to output polarization. In particular, we consider the hybrid adder which has the best performance among the adders for thermal robustness studies. We also compare with the carry flow adder (which has low cell count and delay [2]). The results presented are for the 4-bit version of the adders.
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M. Liu, Robustness and power dissipation in quantum-dot cellular automata. PhD thesis, University of Notre Dame, 2006
H. Cho, E.E. Swartzlander, Adder and multiplier designs in quantum-dot cellular automata. IEEE Trans. Comput. 58(6), 721–727 (2009)
G. Schulhof, K. Walus, G.A. Jullien, Simulation of random cell displacements in QCA. ACM J. Emerg. Technol. Comput. Syst. 3(1), 1–14 (2007)
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© 2015 Springer International Publishing Switzerland
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Sridharan, K., Pudi, V. (2015). Study of Thermal Robustness of QCA Designs. In: Design of Arithmetic Circuits in Quantum Dot Cellular Automata Nanotechnology. Studies in Computational Intelligence, vol 599. Springer, Cham. https://doi.org/10.1007/978-3-319-16688-9_8
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DOI: https://doi.org/10.1007/978-3-319-16688-9_8
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Publisher Name: Springer, Cham
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Online ISBN: 978-3-319-16688-9
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