Abstract
Systems fabricated in microtechnological processes are increasingly employed in industrial products. For that purpose, it is necessary to have a method at hand to measure them, just as macroscopic components and systems too, for reasons of quality assurance. Whereas there already exist a multitude of different systems based on diverse measurement principles for the measurement of single microsystems, a cost-effective measurement of a large number of microsystems on wafer level is currently realizable with optical measurement systems only, a fact that owes less to a technical advantage than to a faster measurement rate. This article portrays arrays fit for a parallelized tactile measurement of geometric dimensions and mechanical qualities of microsystems on a wafer. Moreover, it introduces innovative tactile elements for various measuring tasks and structures to be measured.
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References
Weckenmann, A., Peggs, G., Hoffmann, J.: Probing systems for dimensional micro- and nano-metrology. Measurement Science and Technology 17, 504–509 (2006)
Cao, S., et al.: Recent developments in dimensional metrology for microsystem components. Microsystem Technologies 8, 3–6 (2002)
Bütefisch, S., Dauer, S., Büttgenbach, S.: Silicon three-axial tactile sensor for the investigation of micromechanical structures. In: 9th International Trade Faire and Conference for Sensors, Transducers & Systems (Sensor 1999), vol. 2, pp. 321–326 (1999)
Phataralaoha, A., Büttgenbach, S.: A novel design and characterization of micro probe based on a silicon membrane for dimensional metrology. In: Proc. XIX Eurosensors, vol. 2, p. WPb31, Barcelona, Spain (2005)
Ferreira, N., et al.: Integration of a silicon based microprobe into a gear measuring instrument for accurate measurement of micro gears. In: Proc. 11th International Symposium of Measurement Technology and Intelligent Instruments, Aachen, Germany (2013)
Ferreira, N., et al.: Reducing the Probe Ball Diameters of 3D Silicon-Based Microprobes for Dimensional Metrology. In: Proc. 7th International Conference on Sensing Technology, Wellington, New Zealand, pp. 301–306 (2013)
Claverley, J.D., Leach, R.K.: A vibrating micro-scale CMM probe for measuring high aspect ratio structures. Microsystem Technologies 16(8 – 9), 1507–1512 (2010)
Krah, T., Büttgenbach, S.: Vorrichtung zur parallelen Montage von Mikro-Kraftsensorarrays und taktilen Elementen. In: Proc. Mikrosystemtechnik Kongress, Dresden, Germany, pp. 651–654 (2007)
Krah, T.: Mikrotasterarrays zur parallelisierten Messung von Mikrostrukturen, Dissertation. Shaker Verlag (2011)
Ferreira, N., Krah, T., Büttgenbach, S.: Micro sensors with structurable polymer membrane for accurate 3D force and displacement measurements. In: Proc. IEEE Sensors 2013, Baltimore, Maryland, USA, pp. 1074–1077 (2013), doi:10.1109/ICSENS.2013.6688397, ISBN: 978-1-4673-4642-9
Krah, T., Wedmann, A., Kniel, K., Härtig, F.: Measurement and evaluation processes for inner micro structures. In: Proc. 13th International Conference of the EUSPEN, vol. 1, pp. 120–123 (2013)
Krah, T., Wedmann, A., Kniel, K., Härtig, F.: Mess- und Auswerteverfahren für Mikroinnenstrukturen. In: 6th Kolloquium Mikroproduktion 2013. Schriftenreihe des Institus für Produktionsmesstechnik, Shaker Verlag, vol. 10, p. B22 (2013)
EURAMET cg-10, Version 2.0, Determination of Pitch Diameter of Parallel Thread Gauges by Mechanical Probing (2011)
Krah, T., Lesche, C., Schrader, C., Büttgenbach, S.: Star probes machined by micro-EDM for the use in micro-coordinate metrology. In: Proc. 7th International Workshop on Microfactories, Daejeon, Korea (2010)
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Krah, T., Ferreira, N., Büttgenbach, S., Wedmann, A., Härtig, F., Kniel, K. (2015). Coordinate Measurement on Wafer Level – From Single Sensors to Sensor Arrays. In: Mason, A., Mukhopadhyay, S., Jayasundera, K. (eds) Sensing Technology: Current Status and Future Trends III. Smart Sensors, Measurement and Instrumentation, vol 11. Springer, Cham. https://doi.org/10.1007/978-3-319-10948-0_19
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DOI: https://doi.org/10.1007/978-3-319-10948-0_19
Publisher Name: Springer, Cham
Print ISBN: 978-3-319-10947-3
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