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Reliable Design of Electronic Equipment pp 45–65Cite as

Overstress Analysis

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Abstract

Overstress is defined as exceeding the maximum ratings of components in electronic circuits. Although it is common practice to apply de-rating to components during design, electrical, and thermal overstress analyses are always performed to measure and confirm that components are operating within their maximum ratings. Vibration resonance overstress analysis is also conducted to identify fatigue-related mechanical design defects. Low-cost methods of conducting overstress analyses are presented in tutorial form.

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Author information

Authors and Affiliations

  1. Bangalore, India

    Dhanasekharan Natarajan

Authors
  1. Dhanasekharan Natarajan
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Corresponding author

Correspondence to Dhanasekharan Natarajan .

Appendices

Assessment Exercises

  1. 1.

    Say True or False:

    1. (i)

      Transient current stress in a circuit could induce transient voltage stress also.

    2. (ii)

      Most design-related component failures are due to transient electrical overstress and not due to operating electrical overstress.

    3. (iii)

      Electrical power overstress on components is related to thermal stress on the components.

    4. (iv)

      Improper packaging of components and modules could result in thermal overstress to components.

    5. (v)

      The supply voltages for electronic units in automobiles are derived from battery and hence the units are excluded for transient electrical overstress analysis.

    6. (vi)

      If an item is designed with resilient mounts, the item should be mounted with the resilient mounts for conducting vibration resonance overstress analysis to ensure normal mounting means.

    7. (vii)

      Vibration resonance overstress analysis detects workmanship-related defective solder joints.

    8. (viii)

      Test conditions for vibration resonance overstress analysis on electronic items should be as per the Test Method Standards for conducting environmental tests.

    9. (ix)

      Electrical and thermal overstress analyses need not be performed on modules if the selection and application of components are as per the recommendations of component manufacturers.

  2. 2.

    Describe the method of conducting transient electrical overstress analysis on modules.

  3. 3.

    Describe the method of conducting vibration resonance overstress analysis on modules.

  4. 4.

    Explain the method of estimating worst-case electrical power overstress on discrete semiconductor devices in the modules of equipment.

  5. 5.

    Explain the basis for initiating preventive actions for the components that are experiencing vibration resonance stress.

Laboratory Assignments

  1. 1.

    Conduct overstress analyses on the bought-out products listed below. Identify the overstressed components and recommend appropriate remedial actions considering efforts and cost.

    1. (i)

      SMPS

    2. (ii)

      RF Power Amplifier

    3. (iii)

      LED Lighting unit

    4. (iv)

      Audio power amplifier

    5. (v)

      Battery charger.

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Natarajan, D. (2015). Overstress Analysis. In: Reliable Design of Electronic Equipment. Springer, Cham. https://doi.org/10.1007/978-3-319-09111-2_5

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  • DOI: https://doi.org/10.1007/978-3-319-09111-2_5

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  • Publisher Name: Springer, Cham

  • Print ISBN: 978-3-319-09110-5

  • Online ISBN: 978-3-319-09111-2

  • eBook Packages: EngineeringEngineering (R0)

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