Abstract
As the operating temperature increases, the tradeoff between performance and reliability becomes tricky as the classical hot-carrier (HC) picture has to be modified into the energy-driven formalism, taking into account the scattering mechanisms and thermal effects in ultrashort channel, which lead to current-driven damage in nanometer-scaled MOSFETs. This chapter focuses on the new requirements for advanced modeling of HC phenomena as a function of the scaled digital CMOS nodes. In the first part we recall the classical HC behavior in both N- and P-channel MOSFETs described by the lucky electron model (LEM) in thick (T ox ≥ 7 nm) to medium-range gate-oxide thickness T ox (3.2 nm ≤ T ox ≤ 5 nm), where charge detrapping is involved. Then we present the specificity of decananometer MOSFETs (T ox < 3.2 nm) using a unified energy-driven formalism between high carrier energy to high carrier density, as now cold-carrier (CC) damage results in a multiple-particle (MP) degradation process thermally activated under multivibration excitation of the passivated dangling bonds at the interface. Next, we finally develop a complete modeling for NMOS and PMOS devices that is transferred from DC accelerating damage to AC aging involved in logic cells using an Age(t s) function, for any pulse configurations, which are readily checked between experiments on digital cells at high temperature and the modeling. HC issues and temperature intricacy with bias temperature instability (BTI) are presented through some examples. Finally, we improve the CC modeling by defining a mixed-mode (MM) damage mechanism that lies between single-particle (SP) with high carrier energy processes and MP processes dominated by carrier density, including the progressive change from electron–electron scattering (EES) to multiple-interaction scheme until MP damage. This offers a complete comparison between 28-nm low-power (SiON) silicon bulk CMOS nodes and high-K metal gate (HfSiON) submitted to MP degradation process, with the interplay of thermal effects. It opens new perspectives for an accurate HC to CC reliability determination in actual and future nanoscale CMOS nodes.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
References
G. Baccarani, M.R. Wordeman, R.H. Dennard, IEEE Trans. Electron Devices 31, 452 (1984)
C. Fiegna, H. Iwai, T. Wada, M. Saito, E. Sangiorgi, B. Ricco, IEEE Trans. Electron Devices 41, 941 (1994)
T. Skotnicki, C. Fenouillet-Beranger, C. Gallon, F. Boeuf, S. Monfray, F. Payet, A. Pouydebasque, M. Szczap, A. Farcy, F. Arnaud, S. Clerc, M. Sellier, A. Cathignol, J.-P. Schoellkopf, E. Perea, R. Ferrant, H. Mingam, IEEE Trans. Electron Devices 55, 96 (2008)
G. Groeseneken, R. Degraeve, B. Kaczer, K. Martens, in Proceedings of the European Solid-State Device Research Conference (ESSDERC), vol 64 (2010)
T. Mizuno, S. Sawada, Y. Saitoh, T. Tanaka, IEEE Trans. Electron Devices 38, 584 (1991)
M. Ono, M. Saito, T. Yoshitomi, C. Fiegna, T. Ohguro, H. Iwai, IEEE Trans. Electron Devices 42, 1822 (1995)
A. Bravaix, Y. Mamy Randriamihaja, V. Huard, D. Angot, X. Federspiel, W. Arfaoui, P. Mora, F. Cacho, M. Saliva, C. Besset, S. Renard, D. Roy, E. Vincent, in Proceedings of the International Reliability Physics Symposium (IRPS), vol 2D6 (2013)
J. Franco, B. Kaczer, G. Eneman, P.J. Roussel, M. Cho, J. Mitard, L. Witters, T.Y. Hoffmann, G. Groeseneken, in Proceedings of the International Reliability Physics Symposium (IRPS), vol 624 (2011)
S. Ramey, A. Ashutosh, C. Auth, J. Clifford, M. Hattendorf, J. Hicks, R. James, A. Rahman, V. Sharma, A. St. Amour, C. Wiegand, in Proceedings of the International Reliability Physics Symposium (IRPS), vol 4C.5.1 (2013)
K.F. Schuegraf, C. Hu, IEEE Trans. Electron Devices 41, 1227 (1994)
J.H. Stathis, D.J. DiMaria, in Proceedings of the International Electron Devices Meeting (IEDM), vol 167 (1998)
R. Degraeve, G. Groeseneken, R. Bellens, J.L. Ogier, M. Depas, P.J. Roussel, H.E.E. Maes, IEEE Trans. Electron Devices 45(904) (1998)
E.Y. Wu, J. Sune, Microelectron. Reliab. 45, 1809 (2005)
V. Huard, M. Denais, F. Perrier, N. Revil, C. Parthasarathy, A. Bravaix, E. Vincent, Microelectron. Reliab. 45, 83 (2005)
T. Grasser, B. Kaczer, W. Goes, H. Reisinger, T. Aichinger, P. Hehenberger, P.-J. Wagner, F. Schanovsky, J. Franco, M. Toledano-Luque, M. Nelhiebel, IEEE Trans. Electron Devices 58, 3652 (2011)
D. Vuillaume, A. Bravaix, D. Goguenheim, Microelectron. Reliab. 38, 7 (1998)
C. Guérin, V. Huard, A. Bravaix, IEEE Trans. Device Mater. Reliab. 7, 225 (2007)
C. Hu, F.-C. Tam, P. Hsu, P.-K. Ko, T.-Y. Chan, K.W. Terrill, IEEE Trans. Electron Devices 32(375) (1985)
J.E. Chung, M.-C. Jeng, J.E. Moon, P.K. Ko, C. Hu, IEEE Trans. Electron Devices 37(1651) (1990)
S.E. Rauch, G. La Rosa, IEEE Trans. Device Mater. Reliab. 5, 701 (2005)
G. La Rosa, S.E. Rauch, Microelectron. Reliab. 47, 552 (2007)
S.E. Rauch, G. La Rosa, F.J. Guarin, IEEE Trans. Device Mater. Reliab. 1, 113 (2001)
K. Hess, I.C. Kizilyalli, J.W. Lyding, IEEE Trans. Electron Devices 45, 406 (1998)
K. Hess, L.F. Register, W. McMahon, B. Tuttle, O. Aktas, U. Ravaioli, J.W. Lyding, I.C. Kizilyalli, Phys. B Condens. Matter. 272, 527 (1999)
A. Haggag, W. McMahon, K. Hess, K. Cheng, J. Lee, J. Lyding, in Proceedings of the International Reliability Physics Symposium (IRPS), vol 271 (2001)
K. Hess, A. Haggag, W. McMahon, K. Cheng, L. Lee, J. Lyding, Circuit Dev. Mag. 17, 33 (2001)
A. Haggag, M. Lemanski, G. Anderson, P. Abramovitz, M. Moosa, in Proceedings of the International Reliability Physics Symposium (IRPS), vol 93 (2007)
S. Tyaginov, I. Starkov, C. Jungemann, H. Enichlmair, J.-M. Park, T. Grasser, in Proceedings of the European Solid-State Device Research Conference (ESSDERC), vol 151 (2011)
S. Tyaginov, T. Grasser, in Proceedings of the International Integrated Reliability Workshop, vol 206 (2012)
MiniMOS-NT Device and Circuit Simulator, Institute for Microelectronics, Technische Universität Wien, Austria
S.E. Tyaginov, I.A. Starkov, O. Triebl, J. Cervenka, C. Jungemann, S. Carniello, J.M. Park, H. Enichlmair, M. Karner, C. Kernstock, E. Seebacher, R. Minixhofer, H. Ceric, T. Grasser, Microelectron. Reliab. 50, 1267 (2010)
V. Huard, C.R. Parthasarathy, A. Bravaix, C. Guerin, E. Pion, in Proceedings of the International Reliability Physics Symposium (IRPS), vol. 624 (2009)
A. Bravaix, C. Guérin, V. Huard, D. Roy, J.-M. Roux, E. Vincent, in Proceedings of the International Reliability Physics Symposium (IRPS), vol 531 (2009)
V. Huard, F. Cacho, Y.M. Randriamihaja, A. Bravaix, Microelectron. Eng. 88, 1396 (2011)
C. Guérin, V. Huard, A. Bravaix, J. Appl. Phys. 105, 114513 (2009)
C. Guérin, V. Huard, M. Denais, A. Bravaix, in Proceedings of the IEEE International Integrated Reliability Workshop, vol 63 (2005)
W. McMahon, K. Matsuda, J. Lee, K. Hess, J. Lyding, Model. Simulat. Microsyst. 1, 576 (2002)
D. Vuillaume, J.C. Marchetaux, P.E. Lippens, A. Bravaix, A. Boudou, IEEE Trans. Electron Devices 40, 773 (1993)
A. Bravaix, D. Vuillaume, Solid-State Electron. 41, 1293 (1997)
A. Bravaix, in Proceedings of the IEEE International Integrated Reliability Workshop (IIRW), Tutorial, vol 174 (1999)
E. Amat, T. Kauerauf, R. Degraeve, R. Rodríguez, M. Nafría, X. Aymerich, G. Groeseneken, IEEE Trans. Device Mater. Reliab. 9, 454 (2009)
G.A. Baraff, Phys. Rev. 128, 2507 (1962)
J.L. Moll, R. Van Ovestraeten, Solid-State Electron. 6, 147 (1963)
K. Hess, Solid-State Electron. 21, 123 (1978)
B.K. Riley, J. Phys. C: Solid State Phys. 16, 3373 (1983)
S. Tam, P.-K. Ko, C. Hu, IEEE Trans. Electron Devices 31(1116) (1984)
A. Bravaix, D. Goguenheim, E. Vincent, N. Revil, Microelectron. Eng. 48, 163 (1999)
E. Takeda, H. Kume, S. Asai, IEEE J. Solid-State Circuits 17, 241 (1982)
K. Hofmann, C. Werner, W. Weber, G. Dorda, IEEE Trans. Electron Devices 32, 691 (1985)
T.-Y. Huang, W.W. Yao, R.A. Martin, A.G. Lewis, M. Koyanagi, J.Y. Chen, in Proceedings of the International Electron Devices Meeting (IEDM), vol 742 (1986)
T. Buti, S. Ogura, N. Rovedo, K. Tobimatsu, IEEE Trans. Electron Devices 38, 1757 (1991)
T. Hori, J. Hirase, Y. Odake, T. Yasui, IEEE Trans. Electron Devices 39, 2312 (1992)
P. Heremans, R. Bellens, G. Groeseneken, H.E. Maes, IEEE Trans. Electron Devices 35, 2194 (1988)
P. Heremans, J. Witters, G. Groeseneken, H.E. Maes, IEEE Trans. Electron Devices 36, 1318 (1989)
B.S. Doyle, M. Bourcerie, J.-C. Marchetaux, A. Boudou, IEEE Electron Device Lett. 11, 237 (1990)
B.S. Doyle, M. Bourcerie, C. Bergonzoni, R. Benechi, A. Bravaix, K.R. Mistry, A. Boudou, IEEE Trans. Electron Devices 37, 1869 (1990)
K.R. Mistry, B.S. Doyle, IEEE Electron Device Lett. 11, 267 (1990)
K.R. Mistry, B.S. Doyle, IEEE Trans. Electron Devices 40, 96 (1993)
P. Heremans, R. Bellens, G. Groeseneken, H.E. Maes, B.S. Doyle, M. Bourcerie, C. Bergonzoni, R. Benechi, A. Bravaix, K.R. Mistry, A. Boudou, IEEE Trans. Electron Devices 39, 458 (1992). comment and reply
K.R. Mistry, T.F. Fox, R.P. Preston, N.D. Arora, B.S. Doyle, D.E. Nelsen, IEEE Trans. Electron Devices 40, 1284 (1992)
J.E. Chung, P.K. Ko, C. Hu, IEEE Trans. Electron Devices 38, 1362 (1991)
J.S. Goo, Y.-G. Kim, H.L. Yee, H. Kwon, H. Shin, Solid-State Electron. 38, 1191 (1995)
R. Dreesen, K. Croes, J. Manca, W. De Ceuninck, L. De Schepper, A. Pergoot, G.Groeseneken, in Proceedings of the European Solid-State Device Research Conference (ESSDERC), vol 584 (1999)
M.K. Orlowski, C. Werner, IEEE Trans. Electron Devices 36, 382 (1989)
T. Kaga, T. Hagiwara, IEEE Trans. Electron Devices 35, 929 (1988)
T. Hori, T. Yasui, S. Akamatsu, IEEE Trans. Electron Devices 39, 134 (1992)
P. Balk, Solid State Devices Inst. Phys. Ser. 69, 63 (1983)
B.S. Doyle, G.J. Dunn, IEEE Electron Device Lett. 13, 38 (1992)
C.T. Sah, J.Y.C. Sun, J.J. Tzou, J. Appl. Phys. 54, 944 (1983)
A. Bravaix, D. Goguenheim, N. Revil, E. Vincent, Microelectron. Reliab. 44, 65 (2004)
J.J. Tzou, C.C. Yao, R. Cheung, H.W.K. Chan, IEEE Electron Device Lett. 7, 5 (1986)
Q. Wang, M. Brox, W.H. Krautschneider, W. Weber, IEEE Electron Device Lett. 5, 218 (1991)
A. Bravaix, D. Vuillaume, in Proc. European Solid-State Device Research Conference (ESSDERC), vol 469 (1992)
M. Brox, A. Schwerin, Q. Wang, W. Weber, IEEE Trans. Electron Devices 41, 1184 (1994)
M. Koyanagi, A.G. Lewis, J. Zhu, R.A. Martin, T.Y. Huang, J.Y. Chen, in Proceedings of the International Electron Devices Meeting (IEDM), vol 722 (1986)
E. Rosenbaum, R. Rofan, C. Hu, IEEE Electron Device Lett. 12, 599 (1991)
A. Bravaix, tutorials in Proceedings of the International Reliability Physics Symposium (IRPS), vol 531 (2011)
A. Bravaix, D. Vuillaume, IEEE Trans. Electron Devices 42, 101 (1995)
G. Groeseneken, R. Bellens, G. Van den Bosch, H.E. Maes, Semicond. Sci. Technol. 10, 1208 (1995)
A. Bravaix, D. Vuillaume, D. Goguenheim, V. Lasserre, M. Haond, in Proceedings of the International Electron Devices Meeting (IEDM), vol 873 (1996)
R. Woltjer, G.M. Paulzen, H.G. Pomp, H. Lifka, P.H. Woerlee, IEEE Trans. Electron Devices 42, 109 (1995)
Y. Nissan-Cohen, J. Shappir, D. Frohmann-Bentchkowsky, J. Appl. Phys. 60, 2024 (1985)
M. Brox, W. Weber, IEEE Trans. Electron Devices 38, 1852 (1991)
V. Misra, W.K. Henson, E.M. Vogel, G.A. Hames, P.K. McLarthy, IEEE Trans. Electron Devices 43, 636 (1996)
H.S. Momose, M. Ono, T. Yoshitomi, T. Ohguro, S.I. Nakamura, M. Saito, H. Iwai, IEEE Trans. Electron Devices 43, 1233 (1996)
W.C. Lee, C. Hu, IEEE Trans. Electron Devices 48, 1366 (2001)
D.M. Fleetwood, IEEE Trans. Nuclear Sci. 39, 269 (1992)
C.R. Parthasarathy, M. Denais, V. Huard, G. Ribes, E. Vincent, A. Bravaix, IEEE Trans. Device Mater. Reliab. 7, 130 (2007)
A. Bravaix, D. Goguenheim, V. Huard, M. Denais, C. Parthasarathy, F. Perrier, N. Revil, E. Vincent, Microelectron. Reliab. 45, 1370 (2005)
B.S. Doyle, M. Bourcerie, J.C. Marchetaux, A. Boudou, Electron Device Lett. 8, 234 (1987)
T.C. Ong, M. Levi, P.K. Ko, C. Hu, IEEE Trans. Electron Devices 35, 978 (1988)
M. Bourcerie, B.S. Doyle, J.C. Marchetaux, C. Soret, A. Boudou, IEEE Trans. Electron Devices 37, 708 (1990)
D. Vuillaume, A. Bravaix, J. Appl. Phys. 73, 2559 (1993)
C.R. Parthasarathy, M. Denais, V. Huard, C. Guerin, G. Ribes, E. Vincent, A. Bravaix, in Proceedings of the International Reliability Physics Symposium (IRPS), vol 696 (2007)
M. Denais, A. Bravaix, V. Huard, C. Parthasarathy, G. Ribes, F. Perrier, Y. Rey-Tauriac, N. Revil, in Proceedings of the International Electron Devices Meeting (IEDM), vol 109 (2004)
T.C. Shen, C. Wang, G.C. Abeln, J.R. Tucker, J.W. Lyding, P. Avouris, R.E. Walkup, Science 268, 1590 (1995)
P. Avouris, R.E. Walkup, A.R. Rossi, T.-C. Shen, G.C. Abeln, J.R. Tucker, J.W. Lyding, Chem. Phys. Lett. 257, 148 (1996)
Y. Kamakura, H. Mizuno, M. Yamaji, M. Morifuji, K. Taniguchi, C. Hamaguchi, T. Kunikiyo, M. Takenaka, J. Appl. Phys. 75, 3500 (1994)
K. Hess, B. Tuttle, F. Register, D.K. Ferry, Appl. Phys. Lett. 75, 3147 (1999)
C. Guérin, V. Huard, A. Bravaix, in Proceedings of the International Reliability Physics Symposium (IRPS), vol 692 (2007)
E. Amat, T. Kauerauf, R. Degraeve, R. Rodríguez, M. Nafría, X. Aymerich, G. Groeseneken, IEEE Trans. Device Mater. Reliab. 11, 92 (2011)
A. Bravaix, C. Guérin, D. Goguenheim, V. Huard, D. Roy, C. Besset, S. Renard, Y. Mamy Randriamihaja, E. Vincent, in Proceedings of the International Reliability Physics Symposium (IRPS), vol 55 (2010)
M.V. Fischetti, Phys. Rev. B 31, 2099 (1985)
D.J. Maria, J.H. Stathis, J. Appl. Phys. 89, 5015 (2001)
P.A. Childs, C.C.C. Leung, J. Appl. Phys. 79, 222 (1996)
S.T. Pantelides, S.N. Rashkeev, R. Buczko, D.M. Fleetwood, R.D. Schrimpf, IEEE Trans. Nucl. Sci. 47, 2262 (2000)
V. Huard, M. Denais, C. Parthasarathy, Microelectron. Reliab. 46, 1 (2006)
F.-C. Hsu, K.-Y. Chiu, IEEE Electron Device Lett. 5, 148 (1984)
P. Heremans, G.V.D. Bosch, R. Bellens, G. Groeseneken, H.E. Maes, IEEE Trans. Electron Devices 37, 980 (1990)
B. Ricco, E. Sangiorgi, D. Cantarelli, in Proceedings of the International Electron Devices Meeting (IEDM), vol 92 (1984)
E. Sangiorgi, B. Ricco, P. Olivo, Electron Device Lett. 6, 513 (1985)
J.D. Bude, in Symposium of VLSI Technology Digest, vol 101 (1995)
J.D. Bude, T. Iizuka, Y. Kamakura, in Proceedings of the International Electron Devices Meeting (IEDM), vol 865 (1996)
D.R. Young, E.A. Irene, D.J. Di Maria, R.F. De Keersmacker, H.Z. Massoud, J. Appl. Phys. 50, 6366 (1979)
Y. Nishi, J. Appl. Phys. 10, 52 (1971)
E.H. Poindexter, P.J. Caplan, B.E. Deal, R.R. Razouk, J. Appl. Phys. 52, 879 (1981)
E.H. Poindexter, P.J. Caplan, Prog. Surf. Sci. 14, 201 (1983)
D. Goguenheim, D. Vuillaume, D. Vincent, N.M. Johnson, J. Appl. Phys. 68, 1104 (1990)
G.J. Gerardi, E.H. Poindexter, P.J. Caplan, N.M. Johnson, Appl. Phys. Lett. 49, 348 (1986)
N.M. Johnson, D.K. Biegelsen, M.D. Moyer, S.T. Chang, E.H. Poindexter, P.J. Caplan, Appl. Phys. Lett. 43, 563 (1983)
D. Vuillaume, D. Goguenheim, G. Vincent, Appl. Phys. Lett. 57, 1206 (1990)
J.P. Campbell, P.M. Lenahan, Appl. Phys. Lett. 80, 1945 (2002)
W.L. Warren, P.M. Lenahan, Phys. Rev. B Condens. Matter 42, 1773 (1990)
J.P. Campbell, P.M. Lenahan, C.J. Cochrane, A.T. Krishnan, S. Krishnan, IEEE Trans. Device Mater. Reliab. 7, 540 (2007)
A. Bravaix., V. Huard, G. Goguenheim, E. Vincent, in Proceedings of the International Electron Devices Meeting (IEDM), vol 622 (2011)
W. Mc Mahon, K. Matsuda, J. Lee, K. Hess, J. Lyding, Model. Simulat. Microsyst. vol 576 (2002)
J. Sune, E.Y. Wu, Phys. Rev. Lett. 92, 87601 (2004)
G. Ribes, S. Bruyère, M. Denais, F. Monsieur, V. Huard, D. Roy, G. Ghibaudo, Microelectron. Reliab. 45, 1842 (2005)
B.N.J. Persson, P. Avouris, Surf. Sci. 390, 45 (1997)
B. Tuttle, C.G. Van de Walle, Phys. Rev. B 59, 2631 (1999)
C. Kaneta, T. Yamasaki, Y. Kosaka, Fujitsu Sci. Technol. J. 39, 106 (2003)
R. Biswas, Y.-P. Li, B.C. Pan, Appl. Phys. Lett. 72, 3500 (1998)
K. Stokbro, C. Thirstrup, M. Sakurai, U. Quaade, B.Y.-K. Hu, F. Perez-Murano, F. Grey, Phys. Rev. Lett. 80, 2618 (1998)
H. Ueba, B.N.J. Persson, Surf. Sci. 566–568, 1 (2004)
E. Cartier, D.A. Buchanan, J.H. Stathis, D.J. Di Maria, J. Non-Crystal. Solid 187(244) (1995)
B. Tuttle, Phys. Rev. B 61, 4417 (2000)
R. Bellens, G. Groeseneken, P. Heremans, H.E. Maes, IEEE Trans. Electron Devices 41, 1421 (1994)
K.N. Quader, P. Feng, J.T. Yue, P.K. Ko, C. Hu, IEEE Trans. Electron Devices 41, 681 (1994)
C. Guérin, V. Huard, C. Parthasarathy, J.-M. Roux, A. Bravaix, E. Vincent, Proceedings of the International Reliability Physics Symposium (IRPS), vol 741 (2008)
V. Huard, C.R. Parthasarathy, A. Bravaix, T. Hugel, C. Guérin, E. Vincent, IEEE Trans. Device Mater. Reliab. 7, 558 (2007)
H. Ueba, S.G. Tikhodeev, B.N.J. Persson, Inelastic Tunneling Current-Driven Motions of Single Adsorbates, in Current-Driven Phenomena in Microelectronics (T. Seideman, ed.) (Pan Standford Publishing, Singapore, 2011), p. 26
G. Lüpke, N.H. Tolk, L.C. Feldman, J. Appl. Phys. 93, 2317 (2003)
Y. Mamy Randriamihaja, V. Huard, X. Federspiel, A. Zaka, P. Palestri, D. Rideau, D. Roy, A. Bravaix, Microelectron. Reliab. 52, 2513 (2012)
Y. Mamy Randriamihaja, X. Federspiel, V. Huard, A. Bravaix, in Proceedings of the International Reliability Physics Symposium (IRPS), vol XT1 (2013)
J. Franco, B. Kaczer, M. Toledano-Luque, P.J. Roussel, T. Kauerauf, J. Mitard, L. Witters, T. Grasser, G. Groeseneken, IEEE Trans. Electron Devices 60, 405 (2013)
J. Franco, B. Kaczer, X.Y.Z. This book.
S.E. Rauch, F. Guarin, G. La Rosa, IEEE Trans. Device Mater. Reliab. 10, 40 (2010)
Acknowledgments
This work has been possible thanks to the support of STMicroelectronics Crolles and particularly the help of E. Vincent, whose skills on various reliability fields have enabled us to stay involved and go further. A. Bravaix wants to give special thanks to the fruitful work of all his present and former PhD students he has supervised, and for the pleasure he has had in helping them on the road of circuit reliability, sharing their enthusiasm to improve methodologies, theoretical backgrounds, modeling, and experimental techniques, with youthful eyes that will see further than we will.
Author information
Authors and Affiliations
Corresponding author
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 2015 Springer International Publishing Switzerland
About this chapter
Cite this chapter
Bravaix, A., Huard, V., Cacho, F., Federspiel, X., Roy, D. (2015). Hot-Carrier Degradation in Decananometer CMOS Nodes: From an Energy-Driven to a Unified Current Degradation Modeling by a Multiple-Carrier Degradation Process. In: Grasser, T. (eds) Hot Carrier Degradation in Semiconductor Devices. Springer, Cham. https://doi.org/10.1007/978-3-319-08994-2_3
Download citation
DOI: https://doi.org/10.1007/978-3-319-08994-2_3
Published:
Publisher Name: Springer, Cham
Print ISBN: 978-3-319-08993-5
Online ISBN: 978-3-319-08994-2
eBook Packages: EngineeringEngineering (R0)