Abstract
In this chapter, several new directions are discussed for through silicon via (TSV) fabrication and use in design. Performance comparison between air-Gap gap-based coaxial TSV and conventional circular TSV is presented. The comparison shows that the air-gap TSVs reduce the overall parasitic capacitance and the overall energy loss compared to the conventional circular TSV or conventional coaxial TSV. High-performance 3D TSV interconnects are important for reliability. Choice of the filler material is also a critical issue as thermal incompatibility, electromigration and, high resistivities are still a bottleneck. In this book, SW-CNT bundles are investigated as a prospective filler material for TSV compared to conventional filler materials like Cu, W, and polysilicon. It is found that SW-CNT bundles exhibit unique electrical, thermal, and mechanical characteristics that can be used to fabricate better TSV interconnects.
Moreover, in this chapter, TSV-based adiabatic logic based on the adiabatic switching principle is presented and analyzed. Adiabatic logic is a design technique for minimizing the energy dissipation. Its major limitation is the requirement for passive components, which cannot be efficiently integrated into current generation integrated circuits (ICs). TSV-based 3D heterogeneous integration may enable efficient integration of these passive elements, which were not practically feasible in the past due to technology limitations.
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Salah, K., Ismail, Y., El-Rouby, A. (2015). New Trends in TSV. In: Arbitrary Modeling of TSVs for 3D Integrated Circuits. Analog Circuits and Signal Processing. Springer, Cham. https://doi.org/10.1007/978-3-319-07611-9_8
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DOI: https://doi.org/10.1007/978-3-319-07611-9_8
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