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RETRACTED CHAPTER: High Performance Microelectronic Molding Compounds Cured with Organophosphine Accelerators

  • Conference paper
Proceedings of the 2nd International Conference on Intelligent Technologies and Engineering Systems (ICITES2013)

Part of the book series: Lecture Notes in Electrical Engineering ((LNEE,volume 293))

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Authors and Affiliations

  1. Department of Chemical and Materials Engineering, National University of Kaohsiung, No. 700, Kaohsiung University Rd., Nan-Tzu Dist., Kaohsiung, 81148, Taiwan, Republic of China

    Chean-Cheng Su, Chien-Huan Wei, Yin-Shuo Li & Ping-Hsun Yang

Authors
  1. Chean-Cheng Su
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  2. Chien-Huan Wei
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  3. Yin-Shuo Li
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  4. Ping-Hsun Yang
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Corresponding author

Correspondence to Chean-Cheng Su .

Editor information

Editors and Affiliations

  1. Department of Electrical and Computer Engineering, School of Engineering, Mercer University, Macon, GA, USA

    Jengnan Juang

  2. Department of Electrical Engineering, Cheng Shiu University, Kaohsiung, Taiwan

    Cheng-Yi Chen

  3. Department of Chemical and Materials Engineering, National University of Kaohsiung, Kaohsiung, Taiwan

    Cheng-Fu Yang

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© 2014 Springer International Publishing Switzerland

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Su, CC., Wei, CH., Li, YS., Yang, PH. (2014). RETRACTED CHAPTER: High Performance Microelectronic Molding Compounds Cured with Organophosphine Accelerators. In: Juang, J., Chen, CY., Yang, CF. (eds) Proceedings of the 2nd International Conference on Intelligent Technologies and Engineering Systems (ICITES2013). Lecture Notes in Electrical Engineering, vol 293. Springer, Cham. https://doi.org/10.1007/978-3-319-04573-3_4

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  • DOI: https://doi.org/10.1007/978-3-319-04573-3_4

  • Publisher Name: Springer, Cham

  • Print ISBN: 978-3-319-04572-6

  • Online ISBN: 978-3-319-04573-3

  • eBook Packages: EngineeringEngineering (R0)

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