Abstract
The Coffin-Manson equations of Sn/Ag/Cu and Sn/Pb solder joints are presented in this paper. The experimental results of CSP thermal cycle fatigue test and ball shear test are used to formulate Coffin-Manson equations. The maximum amplitude of equivalent plastic shear strain corresponding to these two experiments are employed. The MARC finite element package is used to calculate the plastic shear strain. Different published fatigue experiment results have been used to show the accuracy and the feasibility of these proposed equations. The 3-D finite element models of the VCSEL assembly are employed to simulate the thermal cycling fatigue. Results indicate that the fatigue life of solder predicted by using the proposed equations have good agreement with those measured from experimental tests.
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© 2014 Springer International Publishing Switzerland
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Qiu, BR., Lin, CH., Lin, AD., Hsu, CM. (2014). The Fatigue Life Analysis of the VCSEL with Sn/Pb and Sn/Ag/Cu Solder. In: Juang, J., Chen, CY., Yang, CF. (eds) Proceedings of the 2nd International Conference on Intelligent Technologies and Engineering Systems (ICITES2013). Lecture Notes in Electrical Engineering, vol 293. Springer, Cham. https://doi.org/10.1007/978-3-319-04573-3_15
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DOI: https://doi.org/10.1007/978-3-319-04573-3_15
Publisher Name: Springer, Cham
Print ISBN: 978-3-319-04572-6
Online ISBN: 978-3-319-04573-3
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