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In-plane Crack Problems in Functionally Graded Piezoelectric Solids

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Dynamic Fracture of Piezoelectric Materials

Part of the book series: Solid Mechanics and Its Applications ((SMIA,volume 212))

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Abstract

In-plane crack analysis of functionally graded piezoelectric solids under time-harmonic loading is performed by using a non-hypersingular traction BIEM. The material parameters are assumed to vary quadratically with both spatial variables. Numerical results for the SIFs are discussed for different examples. Investigated are the effects of the inhomogeneity parameters, the frequency of the applied electromechanical load and the geometry of the crack scenario on the K-factors.

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Authors and Affiliations

  1. Department of Solid Mechanics, Institute of Mechanics, Bulgarian Academy of Sciences, Sofia, Bulgaria

    Petia Dineva

  2. Division of Solid Mechanics, TU Darmstadt, Darmstadt, Germany

    Dietmar Gross

  3. Department of Mechanical and Process Engineering, Institute of Applied Mechanics, TU Kaiserslautern, Kaiserslautern, Germany

    Ralf Müller

  4. Department of Differential Equations and Mathematical Physics, Institute of Mathematics and Informatics, Bulgarian Academy of Sciences, Sofia, Bulgaria

    Tsviatko Rangelov

Authors
  1. Petia Dineva
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  2. Dietmar Gross
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  3. Ralf Müller
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  4. Tsviatko Rangelov
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Correspondence to Tsviatko Rangelov .

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Dineva, P., Gross, D., Müller, R., Rangelov, T. (2014). In-plane Crack Problems in Functionally Graded Piezoelectric Solids. In: Dynamic Fracture of Piezoelectric Materials. Solid Mechanics and Its Applications, vol 212. Springer, Cham. https://doi.org/10.1007/978-3-319-03961-9_10

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  • DOI: https://doi.org/10.1007/978-3-319-03961-9_10

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  • Publisher Name: Springer, Cham

  • Print ISBN: 978-3-319-03960-2

  • Online ISBN: 978-3-319-03961-9

  • eBook Packages: EngineeringEngineering (R0)

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