Effect of Packing Density on Crosstalk in On-chip Optical Interconnects
Optical interconnects hold the promise of revolutionizing computing speed having higher bandwidth and lower power consumption. For high packing density of optical interconnects, crosstalk is calculated considering the coupling of fields of two parallel identical neighboring waveguides. The study shows that there exists minimum pitch for a particular length and width of the interconnects to avoid significant amount of crosstalk. Again, an optimum ratio of width-to-pitch exists for which crosstalk is minimum.
KeywordsCrosstalk Packing density Optical interconnect Width-to-pitch ratio
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- 1.S.Nakagasa, “High-density, low-power optical interconnects for computing systems”, IEEE Photonics Society Summer Topical Meeting, 2010, pp.231-232.Google Scholar
- 4.Po Dong, Wei Qian et.al, “Low Loss Silicon Waveguides for Application of Optical Interconnects”, Proc. IEEE, 2010. pp. 191-192,Google Scholar
- 6.Allan W.Synder, John D.Love, “Optical Waveguide Theory”, London New York, Chapman and Hall, 1st Edition, 1983.Google Scholar
- 8.E.A.Saleh, M.C.Teich “Fundamentals of photonics”, New York press, 1991.Google Scholar