Abstract
High density microprobe arrays have been widely used for several applications. In this work, we are presenting a simple one mask fabrication process of silicon based high density microprobe array (20 × 20) with an array pitch of 20 μm. The dimension of single microprobe structure is: 20 μm × 20 μm × 120 μm. Here, photoresist of 2.5 μm thickness is used as masking layer during the fabrication of microprobe array. The microstructure array is fabricated by using deep reactive ion etching (DRIE). Fabrication aspects of silicon based high density microprobe array are discussed.
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Dutta, S., Yadav, I., Kumar, P., Anand, Pal, R. (2014). Fabrication of High Density Silicon Microprobe Array. In: Jain, V., Verma, A. (eds) Physics of Semiconductor Devices. Environmental Science and Engineering(). Springer, Cham. https://doi.org/10.1007/978-3-319-03002-9_121
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DOI: https://doi.org/10.1007/978-3-319-03002-9_121
Publisher Name: Springer, Cham
Print ISBN: 978-3-319-03001-2
Online ISBN: 978-3-319-03002-9
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